• Photonic Sensors
  • Vol. 12, Issue 2, 130 (2022)
Ting LIANG1, Wangwang LI2、3、*, Cheng LEI1, Yongwei LI1, Zhiqiang LI1, and Jijun XIONG1
Author Affiliations
  • 1Science and Technology on Electronic Test & Measurement Laboratory, North University of China, Taiyuan 030051, China
  • 2Department of Physics, Taiyuan Normal University, Jinzhong 030619, China
  • 3Institute of Computational and Applied Physics, Taiyuan Normal University, Jinzhong 030619, China
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    DOI: 10.1007/s13320-021-0640-7 Cite this Article
    Ting LIANG, Wangwang LI, Cheng LEI, Yongwei LI, Zhiqiang LI, Jijun XIONG. All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing[J]. Photonic Sensors, 2022, 12(2): 130 Copy Citation Text show less
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    Ting LIANG, Wangwang LI, Cheng LEI, Yongwei LI, Zhiqiang LI, Jijun XIONG. All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing[J]. Photonic Sensors, 2022, 12(2): 130
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