[2] N. Narendran, Y. Gu. Life of LED-based white light sources[J]. J. Display Technol., 2005, 1(1): 167~171
[3] M. Pavesi, M. Manfredi. Optical evidence of an electrothermal degradation of InGaN-based light emitting diodes during electrical stress [J]. Appl. Phys. Lett., 2004, 84(17): 3403~3405
[4] Wu Fan. Reliability and Failure Analysis of the High Power Blue LED [D]. Wuhan: Huazhong University of Science and Technology, 2007. 25~44
[5] Wang Lu. Mechanisms Analysis of Light-Emitting Diodes [D]. Beijing: Beijing University of Technology, 2010. 51~52
[7] Lei Yong, Fan Guanghan, Liao Changjun et al.. Research on the thermal property of powerful white LEDs [J]. J. Optoelectronics·Laser, 2006, 17(8): 945~946
[9] B. Yan, N. T. Tran, J. P. You et al.. Can junction temperature alone characterize thermal performance of white LED emitters [C]. IEEE Photon. Technol. Lett., 2011, 23(9): 555~557
[10] Wu Qibao, Qing Shuanggui, Xiong Tao et al.. The preparation and characteration of organic silicone encapsulant [J]. Guangdong Chemical Industry, 2009, 36(2): 23~25
[11] Liu Hao. Reliability Research on the Package of High Power LED [D]. Wuhan: Huazhong University of Science and Technology, 2007. 21~33
[12] Zhang Peng, Chen Yiyu. Study of failure mechanism and evaluation method for plastic encapsulated microelectronics devices [J]. Package & Test Technology, 2006, 31(9): 676~677
[13] J. C. Huang, R. D. Deanin, Y. P. Chu et al.. Comparison of epoxy resins for applications in light-emitting diodes [J]. Adv. Polym. Technol., 2004, 23(4): 298~306