[1] Zhou Guodong, Chen Shuhai, Huang Jihua, et al. Effect of thermal conduction on thermal insulation of double-ceramic-layer thermal barrier coatings[J]. Material Science & Technology, 2012, 20(2): 1-6. (in Chinese)
[2] Li Yong, Chen Zhenmao, Mao Ying, et al. Quantitative evaluation of thermal barrier coating based on eddy current technique[J]. NDT&E International, 2012, 50: 29-35.
[3] Sayar M, Seo D, Ogawa K. Non-destructive microwave detection of layer thickness in degraded thermal barrier coatings using K- and W-band frequency range[J]. NDT&E International, 2009, 42: 398-403.
[4] He Cunfu, Yang Yu′e, Wu Bin. Experimental study on thickness detection of thermal barrier coatings using microwave[J]. Chinese Journal of Scientific Instrument, 2011, 32(11): 2590-2595. (in Chinese)
[5] Tang Qingju. Research on the key technology of SiC coating defects detection using pulsed infrared thermal wave non-destructive testing method[D]. Harbin: Harbin Institute of Technology, 2014. (in Chinese)
[6] Stotter B, Gresslehner K H, Mayr G, et al. Estimation of material parameters from pulse thermagraphy data[C]//AIP Conference Proceedings, 2014, 1581: 1126-1133.
[7] Guo Xingwang, Ding Mengmeng. Simulation of thermal NDT of thickness and its unevenness of thermal barrier coatings[J]. Acta Aeronautica Et Astronautica Sinica, 2010, 31(1): 198-203. (in Chinese)
[8] Chen Lin, Yang Li, Fan Chunli, et al. Quantitative identification of coating thickness and debonding defects of TBC by polse phase technology[J]. Infrared and Laser Engineering, 2015, 44(2): 2050-2056. (in Chinese)
[9] Vitali L, Fustinon D, Gramazio P, et al. Estimation of trial parameters for pulse phase thermagraphy with low power heat sources[J]. Journal of Physics, Conferece Series, 2014, 501: 012008.
[10] Yu Jiajie, Wu Naiming, Zeng Zhi, et al. FRP depth measurement based on pulsed phase thermography [J]. Infrared and Laser Engineering, 2012, 41(7): 1894-1896. (in Chinese)
[11] Yang Shiming, Tao Wenquan. Heat Transfer[M]. 4th ed.Beijing: Higher Education Press, 2006: 41-44. (in Chinese)
[12] Moaveni S. Finite Element Analysis: Theory and Application with ANSYS[M]. 2nd ed. Beijing: Publishing House of Electronics Industry, 2008: 322-324. (in Chinese)
[14] Huang Houcheng, Wang Qiuliang. Heat Transfer Finite Element Analysis[M]. Beijing: Science Press, 2011: 23-25. (in Chinese)