[1] Kenneth K O, KIM K, FLOYD B, et al. The feasibility of on-chip interconnection using antennas[C]. The Proceedings of IEEE/ACM International Conference on Computer-Aided Design,2005:976-981.
[2] JIANG B T, MAO J F, YIN W Y. An efficient ladder reflector antenna for interchip communications[J]. IEEE Antennas and Wireless Propagation Letters,2008,7:777-780.
[3] SEOK Eunyoung, O K K. The impact of power grid to the performance of on-chip antennas[C]. The Proceedings of IEEE International Symposium on Antennas and Propagation Society,2005:532-535.
[4] O K K, KIM K, FLOYD B A, et al. On-chip antennas in silicon ICs and their application[J]. IEEE Transactions on Electron Devices,2005,52(7):1312-1323.
[5] SEOK Eunyoung, O K K. Design rules for improving predictability of on-chip antenna characteristics in the presence of other metal structures[C]. The Proceedings of IEEE International Interconnect Technology Conference, 2005:120-122.
[6] GUO Xiao-Ling. CMOS Intra-chip Wireless Clock Distribution[D]. Ph.D Dissertation, University of Florida, 2005.
[7] BRANCH J, GUO X, GAO L, et al. Wireless communication in a flip-chip package using integrated antennas on silicon substrates[J]. IEEE Electron Device Letters,2005,26(2):115-117.
[8] YOON H, KIM K, O K K. Interference effects on integrated dipole antennas by a metal cover for an integrated circuit package[C]. The Proceedings of IEEE AP-S International Symposium on USNC/URSI National Radio Science Meeting,2000:782-785.
[9] SU Qing-Feng, XIA Yi-Ben, WANG Lin-Jun, et al. Growth and electrical properties of (100)-oriented CVD diamond films[J]. Chinese Journal of Semiconductors,2005,26(5):947-951.
[10] KIM K, Kenneth K O. Integrated dipole antennas on silicon substrates for intra-chip communication[C]. The Proceedings of IEEE International Symposium on Antennas and Propagation Society, 1999:1582-1585.