• Laser & Optoelectronics Progress
  • Vol. 54, Issue 7, 71405 (2017)
Qi Xiaoyong1、2、*, Zhang Wei1、2, Yu Shiwen1、2, Ye Bing1、2, and Wang Aihua1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/lop54.071405 Cite this Article Set citation alerts
    Qi Xiaoyong, Zhang Wei, Yu Shiwen, Ye Bing, Wang Aihua. Microstructure and Mechanical Property of Laser Weld of C18000 Copper Alloy[J]. Laser & Optoelectronics Progress, 2017, 54(7): 71405 Copy Citation Text show less

    Abstract

    The research on laser welding and laser welding with filler wires of 3-mm thick C18000 copper alloy plates is conducted. The microstructures, compositions and mechanical property of welds are analyzed emphatically. The results show that, in the case of direct laser welding, the growth of weld grains appears, the weld microhardness is 90 HV, and the weld strength is only 313 MPa. While in the case of laser welding with ERNiCu-7 filler wires, the mass fraction of Ni from top to bottom of the welds drops from 31% to 10%, the weld structure is single-phase solid solution, the weld microhardness increases to 130-180 HV, and the weld strength increases to 391 MPa. These performances are superior to those for the direct laser welding.
    Qi Xiaoyong, Zhang Wei, Yu Shiwen, Ye Bing, Wang Aihua. Microstructure and Mechanical Property of Laser Weld of C18000 Copper Alloy[J]. Laser & Optoelectronics Progress, 2017, 54(7): 71405
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