• Infrared and Laser Engineering
  • Vol. 45, Issue 7, 705004 (2016)
Ji Yafei*, Zhao Baiqin, and Luo Daxin
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/irla201645.0705004 Cite this Article
    Ji Yafei, Zhao Baiqin, Luo Daxin. Design of an ASIC for the driving and receiving part of dual-wavelength laser fuze[J]. Infrared and Laser Engineering, 2016, 45(7): 705004 Copy Citation Text show less

    Abstract

    Dual-wavelength laser fuse has significant value in the anti-interference of frog and aerosols. In order to decrease the size of the fuze, guarantee the adequacy of the inner space of the missile and optimize the performance of all the system, an ASIC chip for the dual-wavelength laser fuse based on BCD technology was proposed. First, the structure and working principles of the dual-wavelength laser fuse were presented in detail. Then, the design strategy of the chip was deduced and the simulation result of the sub-circuits of the chip was proposed afterwards. The chip is fabricated with a 0.25 μm BCD process. Used in driving the dual-wavelength lasers, when the supply voltage of the chip is 5 V and the supply voltage of the branch of the circuits with lasers is 27 V, the peak power of infrared laser reaches above 30 W, and the peak power of violet laser reaches above 25 W. The pulse width is adjustable in a range of 50-500 ns. The repetition frequency is adjustable in a range of 1-100 kHz. The time window is adjustable at a range of 1-100 μs. The echo signals are separated at the receiving end. Replacing the role of the 4 chips, the dual-wavelength laser fuse ASIC can simplify the structure of the system and optimizes the function of the fuze.
    Ji Yafei, Zhao Baiqin, Luo Daxin. Design of an ASIC for the driving and receiving part of dual-wavelength laser fuze[J]. Infrared and Laser Engineering, 2016, 45(7): 705004
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