• Chinese Journal of Lasers
  • Vol. 36, Issue 11, 3064 (2009)
Yang Wei1、*, Peng Xinhan2, and Zhang Jun1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/cjl20093611.3064 Cite this Article Set citation alerts
    Yang Wei, Peng Xinhan, Zhang Jun. Study of Laser Cutting Technology for Silicon Wafer under Water[J]. Chinese Journal of Lasers, 2009, 36(11): 3064 Copy Citation Text show less

    Abstract

    In order to resolve the problem that the silicon wafer cannot be divided after laser cutting for heat effect,water is used as assistant material to cut the silicon wafer. The influence of laser and water parameters are analyzed. The technique can avoid the influence of water wave. The results of experiment show that the usage of the water as the assistant material can achieve the purpose perfectly for the cool and insulation effect of water.
    Yang Wei, Peng Xinhan, Zhang Jun. Study of Laser Cutting Technology for Silicon Wafer under Water[J]. Chinese Journal of Lasers, 2009, 36(11): 3064
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