• Infrared and Laser Engineering
  • Vol. 48, Issue 11, 1114004 (2019)
Yang Yuting1、2、*, Chen Liheng1, Xu Hetong1、2, Li Shijun1、2, and Wu Yuhua1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/irla201948.1114004 Cite this Article
    Yang Yuting, Chen Liheng, Xu Hetong, Li Shijun, Wu Yuhua. Thermal design of Earth-Moon imaging spectrometer load system for high-altitude balloon platform[J]. Infrared and Laser Engineering, 2019, 48(11): 1114004 Copy Citation Text show less

    Abstract

    In order to meet the long-term observation requirements of the Earth-Moon imaging spectrometers mounted on the high-altitude balloon platform, the thermal design was presented. The corresponding thermal environment of the load system was analyzed, the heat transfer model of the load system was established, and the sensitivity analysis of the main parameters affecting the temperature level of the load system was carried out by using Spearman rank correlation coefficient formula and the BP-Garson method combining backpropagation neural network with Garson formula. The thermal control pattern of the load system was depicted clearly. In addition, the finite element model of the load system was built and the spectrometers′ two working conditions, the December solstice and the June solstice conditions, was simulated by using the I-DEAS/TMG software. The simulation results indicate that under two working conditions, the spectrometers can quickly cool down to -5 ℃ within 2 h, and the spectrometers maintain the temperature level of (-5±2) ℃ for more than 3.5 h, the optical window temperature is higher than the local dew point temperature at the altitude of 20 km, which satisfies the requirements and the thermal design is reasonable. The research jobs could give some guidance and reference for other ball-loaded optical remote sensors.
    Yang Yuting, Chen Liheng, Xu Hetong, Li Shijun, Wu Yuhua. Thermal design of Earth-Moon imaging spectrometer load system for high-altitude balloon platform[J]. Infrared and Laser Engineering, 2019, 48(11): 1114004
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