WANG Zhikuan, FENG Zhihua, CHEN Rong, YAN Zipeng, CUI Wei, LU Ke, LIAO Xiyi. Research Progress of High Density Interconnection Technology for SiC Power Devices[J]. Microelectronics, 2023, 53(3): 465

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- Microelectronics
- Vol. 53, Issue 3, 465 (2023)
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