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    Journals >Semiconductor Optoelectronics >Volume 41 >Issue 3 >Page 379 > Article
    • Semiconductor Optoelectronics
    • Vol. 41, Issue 3, 379 (2020)
    Warpage Control and Correction of InP Wafer in Back-thinning Process
    ZHANG Yuanyuan*, LIU Cong, ZHAO Wenbo, MO Caiping..., DONG Xufeng, HUANG Yulan, LIANG Xingyu, DUAN Lihua, TIAN Kun and ZHANG Hongbo|Show fewer author(s)
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    DOI: 10.16818/j.issn1001-5868.2020.03.015 Cite this Article
    ZHANG Yuanyuan, LIU Cong, ZHAO Wenbo, MO Caiping, DONG Xufeng, HUANG Yulan, LIANG Xingyu, DUAN Lihua, TIAN Kun, ZHANG Hongbo. Warpage Control and Correction of InP Wafer in Back-thinning Process[J]. Semiconductor Optoelectronics, 2020, 41(3): 379 Copy Citation Text show less
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    ZHANG Yuanyuan, LIU Cong, ZHAO Wenbo, MO Caiping, DONG Xufeng, HUANG Yulan, LIANG Xingyu, DUAN Lihua, TIAN Kun, ZHANG Hongbo. Warpage Control and Correction of InP Wafer in Back-thinning Process[J]. Semiconductor Optoelectronics, 2020, 41(3): 379
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