• Optics and Precision Engineering
  • Vol. 23, Issue 2, 452 (2015)
QI Na1,*, LUO Yi2, WANG Xiao-dong1, and WANG Li-ding2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/ope.20152302.0452 Cite this Article
    QI Na, LUO Yi, WANG Xiao-dong, WANG Li-ding. Mechanism and avoiding of polymer melting on non-forming surface during ultrasonic embossing[J]. Optics and Precision Engineering, 2015, 23(2): 452 Copy Citation Text show less

    Abstract

    This paper analyzes the reason why the polymer is melted on a non-forming surface during ultrasonic embossing and proposes a method to inhibit the polymer melting. On the basis of the heating mechanism of ultrasonic, it points out that the polymer melting phenomenon on non-forming surface is resulted by the friction in a horn-substrate interface. Then, it proposed the method “two interfaces of different friction coefficients” to inhibit the polymer melting and implemented the method by coatings surface protection films on the non-forming surface. To optimize the protection films, and the influences of the four coating film conditions on the softening time are examined through Taguchi method. The results show that the Sekisui #622E-50 film shortens the softening time by 3.4 s and the Sekisui #622WB film reduces the softening time error by 0.64 s. It demonstrates that surface protection films coated can avoid polymer melting on the non-forming surface, and improve the process replication ability and the process stability in ultrasonic embossing.
    QI Na, LUO Yi, WANG Xiao-dong, WANG Li-ding. Mechanism and avoiding of polymer melting on non-forming surface during ultrasonic embossing[J]. Optics and Precision Engineering, 2015, 23(2): 452
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