[1] B YANG, Y LIU. BGA packaging technology. Electronics & Packaging, 3, 6-13, 27(2003).

[2] XUE M. Simulation experimental verification on the reliability of BGA packaging. [D]. Guangzhou: South China University of Technology, 2014. (in Chinese)

[3] S ORESJO. New study reveals component defect levels. Circuits Assembly, 13, 39-43(2002).

[4] F GUO. Composite lead-free electronic solders. Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics, 18, 129-145(2007).

[5] L WANG, H DING, Y XIONG. An overview of non-destructive inspection in flip chip packaging. Machinery & Electronics, 4, 45-49(2004).

[6] L TAN, D WANG, J ZHANG. Automated optical Inspection in chip packaging. Science and Technology & Innovation, 23, 66-67, 82(2007).

[7] ROTH H, He Z, PAUL T. Inspection of miniaturised interconnections in IC packages with nanofocus XRay tubes nanoCT [C]10th Electronics Packaging Technology Conference, 2008: 644649.

[8] Ping FU, Guangyu YANG. Situation and developments of X-ray inspection technique for PCB solder joints. Electronics Process Technology, 24, 189-191(2003).

[9] CHAI T C, BRIAN S W, BAI W M, et al. A novel defect detection technique using active transient thermography f high density package interconnections [C]53rd Electronic Components Technology Conference, 2003: 920925.

[10] Renke JING, Jianzeng LI, Hailin ZHOU. Research progress of ultrasonic NDT technology. Foreign Electronic Measurement Technology, 31, 28-30, 34(2012).

[11] Jia GUO, Sihai LI, Ning NING et al. Application of laser ultrasonic technique in non-destructive testing. Advances in Aeronautical Science and Engineering, 5, 487-490, 501(2014).

[12] Guangkai SUN, Zhenggan ZHOU, Xi CHEN. Application of laser ultrasonic technology for nondestructive testing of aerospace composites. Failure Analysis and Prevention, 11, 276-282(2016).

[13] Minghui LU, Lei DING, Xuejun YAN et al. Application and prospect of laser ultrasound technology in industrial testing. Journal of Vibration Measurement & Diagnosis, 41, 631-643, 826(2021).

[14] D S ERDAHL, U I CHARLES. Determination of measurement limit for open solder bumps on a Flip-Chip package using a laser ultrasonic inspection system. IEEE Transactions on Advanced Packaging, 29, 178-185.(2006).

[15] ROHRINGER W, SOMMERHUBER R, CSASZAR L, et al. Material acterization via contactfree detection of surface waves using an optical microphone[C]Fifth International Conference on Sustainable Construction Materials Technologies, 2019, 3: 361373.

[16] B FISCHER, F SARASINI, J TIRILLO et al. Impact damage assessment in biocomposites by micro-CT and innovative air-coupled detection of laser-generated ultrasound. Composite Structures, 922-931(2019).

[17] RUS J, KULLA D, GROSSE C. AirCoupled ultrasonic inspection of FiberReinfced plates using an optical microphone[C]DAGA Deutsche Jahrestagung für Akustik, 2019: 763766.

[18] JIANG Tingting. Noncontact nondestructive testing of cartridge case internal manufacturing defects by using laser ultrasound technology[D]. Nanjing: Nanjing University of Science & Technology, 2018. (in Chinese)

[19] YANG Xiuqing. An iterative backprojection image superresolution algithm based on Lanczos interpolation[D]. Jinan: Shong University, 2018. (in Chinese)