Equivalent Modeling of PCB for Dynamic Properties Based on The Modal Test

Hexin TANG; Wei ZHANG; Zhaoyang GUAN; Yu LIU; Xiaojun GUO; Fengwang LUO; Jiang LI; Ying ZHANG

Journals >Infrared Technology >Volume 44 >Issue 3 >Page 225 > Article

Infrared Technology
Vol. 44, Issue 3, 225 (2022)

Equivalent Modeling of PCB for Dynamic Properties Based on The Modal Test

Hexin TANG^*, Wei ZHANG, Zhaoyang GUAN, Yu LIU, Xiaojun GUO, Fengwang LUO, Jiang LI, and Ying ZHANG

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[in Chinese]

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DOI: Cite this Article

TANG Hexin, ZHANG Wei, GUAN Zhaoyang, LIU Yu, GUO Xiaojun, LUO Fengwang, LI Jiang, ZHANG Ying. Equivalent Modeling of PCB for Dynamic Properties Based on The Modal Test[J]. Infrared Technology, 2022, 44(3): 225 Copy Citation Text

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References

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[5] Pitarresi J M, Primavera A A. Comparison of modeling techniques for the vibration analysis of printed circuit cards[J]. Journal of Electronic Packing, 1992, 114(4): 378-383.

[6] WU J, ZHANG R R, Radons S. Vibration analysis of medical devices with a calibrated FEA model[J]. Computers & Structures, 2002, 80(12): 1081-1086.

[9] TANG W, REN J, FENG G, et al. Study on vibration analysis for printed circuit board of an electronic apparatus[C]//2007 International Conference on Mechatronics and Automation. IEEE, 2007: 855-860.

[10] Karthiheyan S, Verma V K, Saravanan S, et al. Dynamic response characteristics and fatigue life prediction of printed circuit boards for random vibration environments[J]. Journal of Failure Analysis and Prevention, 2020, 20(4): 920-929.

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