Wafer
Mat.a
size/inch
Device
type
Characterization
wavelength
MS
Mat.
cladding
MS min.
CD/nm
height/nm
Lithography
tool
Fabrication
approach
Perfect
absorbers
Mid-IR
(10.0~18.7 µm)
Direct
patterning
(3~10 µm)
Visible
(0.4~0.8 µm)
193 nm DUV
immersion scanner
Near-IR
(1.55 µm)
Polarizing
bandpass filter
Near IR
(1.1~2.5 µm)
Half-wave
plate
Near-IR(1.55 µm)
or Visible(0.633 µm)
(0.633 µm)
248 nm DUV
stepper
(4.6 µm)
Subtractive
color filter
Layer
transfer
Beam
deflector
(0.94 µm)
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