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    Journals >Microelectronics >Volume 51 >Issue 2 >Page 240 > Article
    • Microelectronics
    • Vol. 51, Issue 2, 240 (2021)
    Optimization of Reinforced Component with Glue Process for Surface Mount Components
    LIAO Xiyi, DENG Li, and GAO Zhenkui
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    DOI: 10.13911/j.cnki.1004-3365.200174 Cite this Article
    LIAO Xiyi, DENG Li, GAO Zhenkui. Optimization of Reinforced Component with Glue Process for Surface Mount Components[J]. Microelectronics, 2021, 51(2): 240 Copy Citation Text show less
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    LIAO Xiyi, DENG Li, GAO Zhenkui. Optimization of Reinforced Component with Glue Process for Surface Mount Components[J]. Microelectronics, 2021, 51(2): 240
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