Currently most light emitting diode (LED) components are made with individual chip packaging technology. The main manufacturing processes follow conventional chip-based IC packaging. In the past several years, there has been an uprising trend in the IC industry to migrate from chip-based packaging to wafer level packaging (WLP). Therefore, there is a need for LEDs to catch up. This paper introduces advanced LED WLP technologies. The contents cover key enabling processes such as preparation of silicon sub-mount wafer, implementation of interconnection, deposition of phosphor, wafer level encapsulation, and their integration. The emphasis is placed on how to achieve high throughput, low cost manufacturing through WLP.