• Electro-Optic Technology Application
  • Vol. 29, Issue 5, 79 (2014)
JU Xia1, WEN Shang-sheng1,2, and CHEN Ying-cong1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: Cite this Article
    JU Xia, WEN Shang-sheng, CHEN Ying-cong. Simulation Design and Test of Large-size LED Backlight Heat-dissipation Structure[J]. Electro-Optic Technology Application, 2014, 29(5): 79 Copy Citation Text show less
    References

    [4] Brill K G. Heat density trends in data processing, computer systems and telecommunication equipment[M]. The Uptime Institute, Inc., 2006.

    [12] Liu J, Tam W S, Wong H, et al. Temperature-dependent light-emitting characteristics of InGaN/GaN diodes[J]. Microelectronics Reliability, 2009, 49(1): 38-41

    JU Xia, WEN Shang-sheng, CHEN Ying-cong. Simulation Design and Test of Large-size LED Backlight Heat-dissipation Structure[J]. Electro-Optic Technology Application, 2014, 29(5): 79
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