• Chinese Optics Letters
  • Vol. 11, Issue s1, S10604 (2013)
Bo Yu, Shangqi Kuang, Chun Li, and Chunshui Jin
DOI: 10.3788/col201311.s10604 Cite this Article Set citation alerts
Bo Yu, Shangqi Kuang, Chun Li, Chunshui Jin. Interface engineering to decrease interdif fusion and improve thermal stability of EUV multilayer[J]. Chinese Optics Letters, 2013, 11(s1): S10604 Copy Citation Text show less

Abstract

We use interface engineering technology to obtain high interface quality of extreme ultraviolet (EUV) multilayer. By inserting ultrathin (<0.5 nm) B4C layer between Mo and Si layers in Mo/Si multilayer, the interdiffusion in the multilayer is decreased obviously and the reflectivity can be estimated to increase by 2%. By inserting a new inert material barrer between Mo and Si layers, the thermal stability of new forming Mo/X/Si/X multilayer is increased significantly. The multilayer is annealed at 500 oC for 100 h with the fluctuation of period thickness smaller than 0.1 nm, and the high resolution transmission electron microscopy image also shows that the mirostructure of the multilayer is not changed obviously.
Bo Yu, Shangqi Kuang, Chun Li, Chunshui Jin. Interface engineering to decrease interdif fusion and improve thermal stability of EUV multilayer[J]. Chinese Optics Letters, 2013, 11(s1): S10604
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