STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR

GONG Hai-Mei; ZHANG Ya-Ni; ZHU San-Gen; WANG Xiao-Kun; LIU Da-Fu; DONG De-Ping; YOU Da; LI Xiang-Yang; WANG Ping; ZHU Long-Yuan; FANG Jia-Xiong

Journals >Journal of Infrared and Millimeter Waves >Volume 28 >Issue 2 >Page 85 > Article

Journal of Infrared and Millimeter Waves
Vol. 28, Issue 2, 85 (2009)

STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR

GONG Hai-Mei, ZHANG Ya-Ni, ZHU San-Gen, WANG Xiao-Kun, LIU Da-Fu, DONG De-Ping, YOU Da, LI Xiang-Yang, WANG Ping, ZHU Long-Yuan, and FANG Jia-Xiong

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[in Chinese]

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DOI: Cite this Article

GONG Hai-Mei, ZHANG Ya-Ni, ZHU San-Gen, WANG Xiao-Kun, LIU Da-Fu, DONG De-Ping, YOU Da, LI Xiang-Yang, WANG Ping, ZHU Long-Yuan, FANG Jia-Xiong. STUDY OF RELIABLE PACKAGING FOR IRFPA DETECTOR[J]. Journal of Infrared and Millimeter Waves, 2009, 28(2): 85 Copy Citation Text

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References

[3] Balcerak R S. Technology for infrared sensors produced in low volume, http://www.darpa.mil/mto/sensors/irfpa/index.html.

[4] Tan C W, Chan Y C, Leung B N W, et al. Characterization of Kovar-to-Kovar laser welded joints and its mechanical strength［J］. Optics and Lasersin Engineering, 2005, 43 : 151—162.

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