Development of Back Thinning Technology for Large-Area Array InSb Detector Chip

Hai-yan LI; Ling-xia CAO; Zi-xian CHEN; Ting HUANG; Yu CHEN

doi:10.3969/j.issn.1672-8785.2023.02.002

Journals >INFRARED >Volume 44 >Issue 2 >Page 8 > Article

INFRARED
Vol. 44, Issue 2, 8 (2023)

Development of Back Thinning Technology for Large-Area Array InSb Detector Chip

Hai-yan LI^*, Ling-xia CAO, Zi-xian CHEN, Ting HUANG, and Yu CHEN

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[in Chinese]

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DOI: 10.3969/j.issn.1672-8785.2023.02.002 Cite this Article

LI Hai-yan, CAO Ling-xia, CHEN Zi-xian, HUANG Ting, CHEN Yu. Development of Back Thinning Technology for Large-Area Array InSb Detector Chip[J]. INFRARED, 2023, 44(2): 8 Copy Citation Text

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LI Hai-yan, CAO Ling-xia, CHEN Zi-xian, HUANG Ting, CHEN Yu. Development of Back Thinning Technology for Large-Area Array InSb Detector Chip[J]. INFRARED, 2023, 44(2): 8

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