Author Affiliations
1School of Optics and Photonics, Beijing Institute of Technology, Beijng 100081, China2Beijing Key Lab for Precision Optoelectronic Measurement Instrument and Technology, Beijing 100081, Chinashow less
Fig. 1. Structural diagram of infrared scene projector chip
Fig. 2. Principle block diagram of spatial resolution measurement
Fig. 3. Temperature distribution in chip plane
Fig. 4. Temperature gradient in y-direction
Fig. 5. Temperature distribution calculation model of MEMS chip with periodical microstructure
Fig. 6. Distribution of radiation intensity along x-direction
Fig. 7. Process diagram of MTF curve calculation
Fig. 8. Schematic of microstructure used for contact area ratio analysis. (a) 2D diagram of microstructure; (b) 3D diagram of microstructure
Fig. 9. Thermal radiation intensity distributions along x-direction of chips with different contact area ratios
Fig. 10. MTF curves of microstructured chips with different contact area ratios
Fig. 11. Schematic of microstructure used for filling factor analysis
Fig. 12. Thermal radiation intensity distributions of microstructured chips with different filling factors
Fig. 13. MTF curves of microstructured chips with different filling factors
Fig. 14. In-plane microstructures of infrared scene projector chips. (a) Contact area ratio of 0.20; (b) contact area ratio of 0.46
Fig. 15. Sample photo of infrared scene projector chip
Fig. 16. Microscope images of periodical microstructure. (a) Contact area ratio of 0.2; (b) contact area ratio of 0.46
Fig. 17. Experimental device diagram of spatial resolution measurement
Fig. 18. Measurement results obtained by infrared thermal imager. (a) Thermal radiation intensity distribution on chip surface; (b) temperature distribution along x-direction
Fig. 19. Radiation intensity distribution curves along x-axis of two chip samples
Fig. 20. MTF curves of two infrared scene projector chip samples