[2] Sato K,Shikida M,Matsushima Y.Characterization of orientationdependent etching properties of single-crystal silicon: effects of KOH concentration[J].Sensors and Actuators A, 1998,64: 87-93.
[4] Huang C ,Najafi K.Fabrication of ultrathin P++ silicon microstructurcs using ion implantation and boron etch-stop[J].Journal of Microelectromechanical Systems, 2001,10(4): 532-537.
[6] Moldovan C,Iosub R,Dascalu D,et al. An investigation of an alka line system for silicon anistropic etching[A]. Proceedings of the Workshop of Physical Chemistry of Wet Chemical Etching of Silicon [C].Netherland: Holten, 1998,1.21-22.