• Infrared and Laser Engineering
  • Vol. 50, Issue 7, 20211050 (2021)
Li Li1、2 and Qinggui Tan1、2、*
Author Affiliations
  • 1National Key Laboratory of Science and Technology on Space Microwave, Xi’an 710100, China
  • 2China Academy of Space Technology (Xi’an), Xi’an 710100, China
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    DOI: 10.3788/IRLA20211050 Cite this Article
    Li Li, Qinggui Tan. Exploration and preliminary application of high throughput satellite with microwave photonics (Invited)[J]. Infrared and Laser Engineering, 2021, 50(7): 20211050 Copy Citation Text show less
    References

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    [2] Jinqian Yuan, Yidan Luo, Weiwei Gao. Analysis on the development trend of foreign Q/V band communication satellites. Space International, 499, 42-46(2020).

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    [5] Bo Li. Research on flexibility of foreign communication satellite system. Space International, 473, 23-32(2018).

    [6] Hang Zhang. The latest development of foreign high-throughput-satellites. Satellite Communication, 6, 53-57(2017).

    [7] Huipeng Han. Overview of the development of foreign high-throughput satellites. Satellite and Internet, 8, 34-38(2018).

    [8] Xu Wang. The successful launch of No. 13 of practice satellite opens the era of chinese high-throughput communication satellite. Aerospace China, 13(2017).

    [9] Anzalchi J, Inigo P, Roy B. Application of photonics in next generation telecommunication satellites payloads[C]ICSO, 2017, 10563: 105633O.

    [10] Shilong Pan, Dan Zhu, Shifeng Liu, et al. Satellite payloads pay off. IEEE Microwave Magazine, 16, 61-73(2015).

    [11] V C Duarte, J G Prata, C F Ribeiro, et al. Modular coherent photonic-aided payload receiver for communications satellites. Nature Communications, 10, 1-9(2019).

    [12] Piqueras M A, Martí J, Delgado S, et al. A flight demonstration photonic payload f up to QVb implemented in a satellite Kab hosted payload aimed at broadb highthroughput satellites[C]ICSO, 2019, 11180: 111804S.

    Li Li, Qinggui Tan. Exploration and preliminary application of high throughput satellite with microwave photonics (Invited)[J]. Infrared and Laser Engineering, 2021, 50(7): 20211050
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