The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group

SHI Song; KONG Lei; QI Hui-min; ZHANG Da-hai

doi:10.3964/j.issn.1000-0593(2013)03-0647-06

Journals >Spectroscopy and Spectral Analysis >Volume 33 >Issue 3 >Page 647 > Article

Spectroscopy and Spectral Analysis
Vol. 33, Issue 3, 647 (2013)

The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group

SHI Song^1、*, KONG Lei², QI Hui-min³, and ZHANG Da-hai²

Author Affiliations

¹[in Chinese]

²[in Chinese]

³[in Chinese]

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DOI: 10.3964/j.issn.1000-0593(2013)03-0647-06 Cite this Article

SHI Song, KONG Lei, QI Hui-min, ZHANG Da-hai. The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group[J]. Spectroscopy and Spectral Analysis, 2013, 33(3): 647 Copy Citation Text

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References

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[2] Itoh M, Inoue K, Iwata K. Advanced Materials, 1997, 9: 1187.

[3] Itoh M, Inoue K, Iwata K, et al. Macromolecules, 1997, 30: 694.

[4] Itoh M, Iwata K, Ishikawa J I, et al. Journal of Polymer Science Part a-Polymer Chemistry, 2001, 39: 2658.

[5] Kuroki S, Ishikawa J, Itoh M. Macromolecules, 1998, 31: 2804.

[6] Itoh M, Inoue K, Hirayama N, et al. Journal of Material Science, 2002, 37: 3795.

[7] Ogasawara T, Ishikawa T, Yamada T, et al. Journal of Composite Materials, 2002, 36: 143.

[11] Ye Li, Han WeiJiang, Zhang Ruilin, et al. Journal of Applied Polymer Science, 2008, 110: 4064.

[13] Krevelen D W, Nijenhuis K T. Properties of Polymers. Elsevier, 2009.

SHI Song, KONG Lei, QI Hui-min, ZHANG Da-hai. The Curing Behavior of Two Thermoset Resins Containing Silicon Alkynyl Group[J]. Spectroscopy and Spectral Analysis, 2013, 33(3): 647

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