• Laser & Optoelectronics Progress
  • Vol. 52, Issue 1, 11404 (2015)
Chen Hua1、*, Xue Shoulong1、2, and Hu Hong2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less
    DOI: 10.3788/lop52.011404 Cite this Article Set citation alerts
    Chen Hua, Xue Shoulong, Hu Hong. Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser[J]. Laser & Optoelectronics Progress, 2015, 52(1): 11404 Copy Citation Text show less
    References

    [1] Coherent Inc. Laser-Operation, Equipment, Application and Design[M]. New York: McGraw-Hill, 1980. 137-196.

    [2] K A Butting, G Cornfield. Towards a general theory of cutting relationship between the incident power density and the cut speed[J]. ASME J Heat Transf, 1975, 97(1):116-122.

    [3] P D Pietro. A numerical investigation into cutting front mobility in CO2 laser cutting[J]. Int J Mach Tools Manuf, 1995, 35(5): 673-688.

    [4] Wang Kunlin. Mathematical models of laser material processing[J]. Laser Journal, 1996, 17(3): 105-108.

    [5] Gu Jianhui, Li Zaiguang, Chen Shushu. Study on the interaction and dynamic process of high-power laser beams with material[J]. Laser Journal, 1992, 13(2): 57-61.

    [6] Zhang Yingcong, Shen Hua, Zhu Rihong. Three- dimensional temperature field of material irradiated by continuous wave laser[J]. Chinese J Lasers, 2013, 40(8): 0806002.

    [7] Zhu Kai, Long Lianchun. Numerical simulation and experiment contrast about laminated plate under laser irradiation [J]. Chinese J Lasers, 2012, 39(1): 0103004.

    [8] Gao Shiyou, Ma Lei, Zhang Runsheng. Method of monitoring cutting point state in laser cutting plank process based on vision[J]. Chinese J Lasers, 2012, 39(2): 0203007.

    [9] Wang Xinggang, Zhou Ming, Di Jianke, et al.. Numerical simulation and experiment of CO2 laser cutting electronic strengthened glass[J]. Laser & Optoelectronics Progress, 2012, 49(9): 091402.

    CLP Journals

    [1] Jiang Xinbo, Li Jinzhe, Bai Yan, Wu Zhe, Yang Chunmei, Ma Yan. Laser Cutting Wood Test and Influencing Factors of Processing Quality[J]. Laser & Optoelectronics Progress, 2016, 53(3): 31403

    [2] Xiao Heping, Chen Liang, Ma Xiangzhu, Yang Kai. Research on Laser Processing Technology of Silicon Substrate AlGaInP LED[J]. Laser & Optoelectronics Progress, 2016, 53(10): 101401

    [3] Ou Changjin, Qin Caibao, Jiang Xianfeng, Dong Xingtao. Study on Energy Distribution of Non-Vertical Laser Cutting[J]. Laser & Optoelectronics Progress, 2017, 54(4): 41407

    Chen Hua, Xue Shoulong, Hu Hong. Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser[J]. Laser & Optoelectronics Progress, 2015, 52(1): 11404
    Download Citation