[1] HU Xiao-cao, DIAO Xun-gang, HAO Lei. Preparation of large area TiO2／Ag／Ti／TiO2 multilayers on flexible substrate and its optoelectronic and infrared emission properties［J］. Chinese Journal of Rare Metals, 2008, 32(3): 300-305.

[2] CLARYSSE T, HOFLIJK I, ZHANG W, et al. Metal film characterization with qualified spreading resistance［J］. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004, 22(1): 444-449.

[3] TAMIRISA P, LEVITIN G, KULKARNI N, et al. Plasma etching of copper films at low temperature［J］. Microelectronic Engineering, 2007, 84(1): 105-108.

[4] ZHANG W, BRONGERSMA S, CLARYSSE T,et al. Surface and grain boundary scattering studied in beveled polycrystalline thin copper films［J］. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2004, 22(4): 1830-1833.

[5] FAN Ping. Electric conductivity characteristics of ultrathin metallic films［J］. Acta Metallurgica Sinica, 1999, 35(3): 261-264.

[6] WANG De-fei, QI Wen-zong, GUO Chun-feng. Simulation study of thermal and mechanical effect on metal film irradiated by ultra-fast laser pulse［J］. Acta Photonica Sinica, 2008, 37(11): 2172-2176.

[7] WU Ying-cai, GU Zheng. Research on the optimum thickness of metallic thin film utilized to excite surface plasmon resonance［J］. Acta Physica Sinica, 2008, 57(4): 2295-2299.

[8] ZHAO Gang, HAO Qiu-long, QI Wen-zong, et al. Thermal behavior of thin metal films irradiated by ultra-short pulse laser［J］. Acta Photonica Sinica, 2007, 36(1): 9-12.

[9] FAN Ping, LAI Guo-yan. Calculation of metallic films resistivities［J］. Vacuum Science and Technology, 1999, 19(6): 445-451.