In order to improve the high density assembly technology of remote sensing camera, a high density TDI CCD imaging system was designed with multichip module technology. First, TDI CCD focal plane with mechanical splicing technology was made to a copied unit. Then, the output energy of CCD output image signals was improved by a transistor emitter follower, they were transmitted to the analog front-end chips. Then they were converted into the 14 bits digital signals. After that they were integrated and processed through field programmable gate array (FPGA). In the end, through TLK2711 high-speed chip they were sent to data acquisition card on the computer. All the driving signals and processing signals of the imaging system were produced by the FPGA. The computer can control the imaging system and exchange the parameter through RS422 communication bus. The experimental results show that the area of driving layout cut down 2/3 than convention design. It realized the camera′s high density assembly adopting the design of the mechanical and electrical integration of heat. And the total data speed can reach 3.6 Gbps in this imaging system, SNR can reach 52.6 dB.