• Acta Photonica Sinica
  • Vol. 41, Issue 2, 240 (2012)
XU Guang-hui1、*, CHAI Guang-yue1, PENG Jin-hua2, HUANG Chang-tong1, DUAN Zi-gang1, and TAN Ke-min3
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • 3[in Chinese]
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    DOI: 10.3788/gzxb20124102.0240 Cite this Article
    XU Guang-hui, CHAI Guang-yue, PENG Jin-hua, HUANG Chang-tong, DUAN Zi-gang, TAN Ke-min. High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors[J]. Acta Photonica Sinica, 2012, 41(2): 240 Copy Citation Text show less

    Abstract

    Based on the frequency response model,high frequency characteristic analysis for the TO packaged avalanche photodetectors is presented.The influence on frequency performance of TO packaging,including chip,bondwire,transimpedance amplifer,and TO header elements are investigated.By changing inductance parameters induced by different bandwires,the different frequency responses are observed.Finally,by considering the engineering conditions,a -3 dB bandwidth of 10GHz is optimally obtained for TO packaging.
    XU Guang-hui, CHAI Guang-yue, PENG Jin-hua, HUANG Chang-tong, DUAN Zi-gang, TAN Ke-min. High Frequency Analysis of TO Packaging for High-speed Avalanche Photodetectors[J]. Acta Photonica Sinica, 2012, 41(2): 240
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