• Optics and Precision Engineering
  • Vol. 23, Issue 3, 708 (2015)
FAN Jian-hua1,2,*, DENG Yong-bo1, XUAN Ming1, LIU Yong-shun1,2..., WU Jun-feng1 and WU Yi-hui1|Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/ope.20152303.0708 Cite this Article
    FAN Jian-hua, DENG Yong-bo, XUAN Ming, LIU Yong-shun, WU Jun-feng, WU Yi-hui. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Optics and Precision Engineering, 2015, 23(3): 708 Copy Citation Text show less
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    FAN Jian-hua, DENG Yong-bo, XUAN Ming, LIU Yong-shun, WU Jun-feng, WU Yi-hui. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Optics and Precision Engineering, 2015, 23(3): 708
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