[1] MOSES E I, CAMPBELL J H, STOLZ C J, et al.. The national ignition facility: the world′s largest optics and laser system［J］.SPIE, 2003, 5001:1-15.
[2] MOSES E I. National ignition facility: 1.8 MJ, 750 TW ultraviolet laser［J］. SPIE, 2004, 5341: 13-24.
[3] ANDRE M L. Status of the LMJ project［J］. SPIE, 1996, 3047: 38-42.
[4] PENG H S, ZHANG X M, WEI X F, et al.. Design of 60-kJ SG-Ⅲ laser facility and related technology development［J］. SPIE, 2001, 4424: 98-103.
[5] XIAO G Y, FAN D Y, WANG S J, et al.. SG-Ⅱ solid-state laser ICF system［J］. SPIE, 1998, 3492: 890-895.
[6] CAMP D M, KOZLOWSKI M R, SHEEHAN L M, et al.. Subsurface damage and polishing compound affect the 355 nm laser damage threshold of fused silica surfaces［R］.UCRL-JC-129301, 1997.
[7] GNIN F Y, SALLEO A, PISTOR T V, et al.. Role of light intensification by cracks in optical breakdown on surfaces［J］. Journal of the Optical Society of America A, 2001, 18(10): 2607-2616.
[8] YANG M H, QI H J, ZHAO Y N, et al.. Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica ［J］. SPIE, 2011, 8206: 82061C-1-7.
[9] NEAUPORT J, CORMONT P, LAMAIGNRE L, et al.. Concerning the impact of polishing induced contamination of fused silica optics on the laser-induced damage density at 351 nm［J］. Optics Communications, 2008, 281(14): 3802-3805.
[10] LIU H J, HUANG J, YE X, et al.. Residual impurities on fused silica surface processed by different technics and their effects on laser induced damage at 355 nm ［J］. Optoelectron. Adv. Mater., 2015,17:1406-1410.
[11] LIU H J, YE X, ZHOU X D, et al.. Subsurface defects characterization and laser damage performance of fused silica optics during HF-etched process ［J］. Optical Materials, 2014, 36(5): 855-860.
[12] LIU H J, HUANG J, WANG F R, et al.. Subsurface defects of fused silica optics and laser induced damage at 351 nm［J］. Optics Express, 2013, 21(10): 12204-12217.
[13] NEAUPORT J, AMBARD C, CORMONT P, et al.. Subsurface damage measurement of ground fused silica parts by HF etching techniques［J］. Optics Express, 2009, 17(22): 20448-20456.
[14] SURATWALA T, WONG L, MILLER P, et al.. Sub-surface mechanical damage distributions during grinding of fused silica［J］. Journal of Non-Crystalline Solids, 2006, 352(52/53/54): 5601-5617.
[15] ZHOU Y Y, FUNKENBUSCH P D, QUESNEL D J, et al.. Effect of etching and imaging mode on the measurement of subsurface damage in microground optical glasses［J］. Journal of the American Ceramic Society, 1994, 77(12): 3277-3280.
[16] MENAPACE J A, DAVIS P J, STEELE W A, et al.. MRF applications: measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique［R］. UCRL-PROC-217271, 2005.
[17] LIU J, MA ZH L, WANG J L, et al.. Research status of subsurface damage detection technology of optical elements［J］. Laser & Optoelectronics Progress, 2011, 48:081204. (in Chinese)
[18] TIAN A L, DANG J J, WANG CH H, et al.. Optical subsurface damage detection and its analysis［J］. Journal of Xi′an Technological University, 2011, 31(4):24-28. (in Chinese)
[19] FHNLE O, WONS T, KOCH T, et al.. ITIRM as a tool for qualifying polishing processes ［J］. Appl. Opt., 2002, 41: 4036-4038.
[20] WUTTIG A.,STEINERT J, DUPARRE A. et al.. Surface roughness and subsurface damage characterization of fused silica substrates［J］. SPIE, 1999, 3739: 369-376.
[21] MA B, SHEN Z X, HE P F, et al.. Detection of subsurface defects of fused silica optics by confocal scattering microscopy ［J］.Chinese Optics Letters, 2010, 8(3):296-299.
[22] CHENG J, WANG J H, ZHANG P Y, et al.. Experimental study on HF etching of fused silica［J］. High Power Laser and Particle Beams, 2017, 29(11): 8-14. (in Chinese)
[23] ZHU Y N, MAI L B, LIU Q M et al.., Test methods for laser induced damage threshold of optical surfaces.Part 1: 1 on 1 test, GB/T 16601-1996［S］. National Technology Supervision Bureau, 1996. (in Chinese)
