• Journal of Terahertz Science and Electronic Information Technology
  • Vol. 18, Issue 3, 538 (2020)
ZHENG Xianze, TANG Bin, WANG Yue, and XIONG Zhuang*
Author Affiliations
  • [in Chinese]
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    DOI: 10.11805/tkyda2019046 Cite this Article
    ZHENG Xianze, TANG Bin, WANG Yue, XIONG Zhuang. Research progress of micro-scale hemispherical resonator gyroscopes based on etching of HNA solution[J]. Journal of Terahertz Science and Electronic Information Technology , 2020, 18(3): 538 Copy Citation Text show less
    References

    [5] NAGOURNEY T,CHO J Y,DARVISHIAN A,et al. Effect of metal annealing on the Q-factor of metal-coated fused silica micro shell resonators[C]// IEEE International Symposium on Inertial Sensors & Systems. Hapuna Beach,HI,USA:IEEE, 2015:13-17.

         NAGOURNEY T,CHO J Y,DARVISHIAN A,et al. Effect of metal annealing on the Q-factor of metal-coated fused silica micro shell resonators[C]// IEEE International Symposium on Inertial Sensors & Systems. Hapuna Beach,HI,USA:IEEE, 2015:13-17.

    [6] CHO J Y,YAN J,GREGORY J A,et al. 3-dimensional blow torch-molding of fused silica microstructures[J]. Journal of Microelectromechanical Systems, 2013,22(6):1276- 1284.

         CHO J Y,YAN J,GREGORY J A,et al. 3-dimensional blow torch-molding of fused silica microstructures[J]. Journal of Microelectromechanical Systems, 2013,22(6):1276- 1284.

    [7] BOYD C,WOO J K,CHO J Y,et al. Effect of drive-axis displacement on MEMS birdbath resonator gyroscope performance[C]// 2017 IEEE International Symposium on Inertial Sensors and Systems(INERTIAL). Kauai,HI,USA:IEEE, 2017:1-2.

         BOYD C,WOO J K,CHO J Y,et al. Effect of drive-axis displacement on MEMS birdbath resonator gyroscope performance[C]// 2017 IEEE International Symposium on Inertial Sensors and Systems(INERTIAL). Kauai,HI,USA:IEEE, 2017:1-2.

    [8] PAI P,CHOWDHURY F K,MASTRANGELO C H,et al. MEMS-based hemispherical resonator gyroscopes[C]// 2012 IEEE SENSORS. Taipei,Taiwan,China:IEEE, 2012:1-4.

         PAI P,CHOWDHURY F K,MASTRANGELO C H,et al. MEMS-based hemispherical resonator gyroscopes[C]// 2012 IEEE SENSORS. Taipei,Taiwan,China:IEEE, 2012:1-4.

    [9] PAI P,CHOWDHURY F K,POURZAND H,et al. Fabrication and testing of hemispherical MEMS wineglass resonators[C]// IEEE International Conference on Micro Electro Mechanical Systems. Taipei,Taiwan,China:IEEE, 2015:677-680.

         PAI P,CHOWDHURY F K,POURZAND H,et al. Fabrication and testing of hemispherical MEMS wineglass resonators[C]// IEEE International Conference on Micro Electro Mechanical Systems. Taipei,Taiwan,China:IEEE, 2015:677-680.

    [10] VAFANEJAD A,KIM E S. Effect of diaphragm perforation on quality factor of hemispherical resonator gyroscope[C]// Transducers-International Conference on Solid-state Sensors. Anchorage,AK,USA:IEEE, 2015:27-30.

         VAFANEJAD A,KIM E S. Effect of diaphragm perforation on quality factor of hemispherical resonator gyroscope[C]// Transducers-International Conference on Solid-state Sensors. Anchorage,AK,USA:IEEE, 2015:27-30.

    [11] FEGELY L C,HUTCHISON D N,BHAVE S A. Isotropic etching of 111 SCS for wafer-scale manufacturing of perfectly hemispherical silicon molds[C]// Solid-state Sensors, Actuators & Microsystems Conference. Beijing:IEEE, 2011:2295-2298.

         FEGELY L C,HUTCHISON D N,BHAVE S A. Isotropic etching of 111 SCS for wafer-scale manufacturing of perfectly hemispherical silicon molds[C]// Solid-state Sensors, Actuators & Microsystems Conference. Beijing:IEEE, 2011:2295-2298.

    [12] MUSTAFA M T,SEN D,AJAY B,et al. Acceleration insensitive hemispherical shell resonators using pop-up rings[C]// IEEE International Conference on Micro Electro Mechanical Systems. Belfast,UK:IEEE, 2018:956-959.

         MUSTAFA M T,SEN D,AJAY B,et al. Acceleration insensitive hemispherical shell resonators using pop-up rings[C]// IEEE International Conference on Micro Electro Mechanical Systems. Belfast,UK:IEEE, 2018:956-959.

    [13] GRAY J M,HOULTON J P,GERTSCH J C,et al. Hemispherical micro-resonators from atomic layer deposition[J]. Journal of Micromechanics and Microengineering, 2014,24 (12):125028-125037.

         GRAY J M,HOULTON J P,GERTSCH J C,et al. Hemispherical micro-resonators from atomic layer deposition[J]. Journal of Micromechanics and Microengineering, 2014,24 (12):125028-125037.

    [14] STEINERT M,ACKER J,OSWALD S,et al. Study on the mechanism of silicon etching in HNO3-rich HF/HNO3 mixtures[J]. Journal of Physical Chemistry C, 2007,111(5):2133- 2140.

         STEINERT M,ACKER J,OSWALD S,et al. Study on the mechanism of silicon etching in HNO3-rich HF/HNO3 mixtures[J]. Journal of Physical Chemistry C, 2007,111(5):2133- 2140.

    [15] STEINERT M,ACKER J,MATTHIASK,et al. Reactive species generated during wet chemical etching of silicon in HF/HNO3 mixtures[J]. Journal of Physical Chemistry B, 2006,110(23):11377-11381.

         STEINERT M,ACKER J,MATTHIASK,et al. Reactive species generated during wet chemical etching of silicon in HF/HNO3 mixtures[J]. Journal of Physical Chemistry B, 2006,110(23):11377-11381.

    [16] STEINERT M,ACKER J,WETZIG K. New aspects on the reduction of nitric acid during wet chemical etching of silicon in concentrated HF/HNO3 mixtures[J]. Journal of Physical Chemistry C, 2008,112(36):14139-14144.

         STEINERT M,ACKER J,WETZIG K. New aspects on the reduction of nitric acid during wet chemical etching of silicon in concentrated HF/HNO3 mixtures[J]. Journal of Physical Chemistry C, 2008,112(36):14139-14144.

    [17] HAMZAH A A,YEOP MAJLIS B,YUNAS J,et al. Optimization of HNA etching parameters to produce high aspect ratio solid silicon microneedles[J]. Journal of Micromechanics & Microengineering, 2012,22(9):95017-95026.

         HAMZAH A A,YEOP MAJLIS B,YUNAS J,et al. Optimization of HNA etching parameters to produce high aspect ratio solid silicon microneedles[J]. Journal of Micromechanics & Microengineering, 2012,22(9):95017-95026.

    [18] TURNER D R. On the mechanism of chemically etching germanium and silicon[J]. Journal of the Electrochemical Society, 1960,107(10):810-816.

         TURNER D R. On the mechanism of chemically etching germanium and silicon[J]. Journal of the Electrochemical Society, 1960,107(10):810-816.

    [19] SCHWARTZ B,ROBBINS H. Chemical etching of silicon I-the system HF,HNO3 and H2O[J]. Journal of the Electrochemical Society, 1959,106(6):505-508.

         SCHWARTZ B,ROBBINS H. Chemical etching of silicon I-the system HF,HNO3 and H2O[J]. Journal of the Electrochemical Society, 1959,106(6):505-508.

    [20] SCHWARTZ B,ROBBINS H.Chemical etching of silicon II-the system HF,HNO 3,H2O and HC2H3O2[J]. Journal of the Electrochemical Society, 1960,107(2):108-111.

         SCHWARTZ B,ROBBINS H.Chemical etching of silicon II-the system HF,HNO 3,H2O and HC2H3O2[J]. Journal of the Electrochemical Society, 1960,107(2):108-111.

    [21] SCHWARTZ B,ROBBINS H. Chemical etching of silicon III-a temperature study in the acid system[J]. Journal of the Electrochemical Society, 1961,108(4):365-372.

         SCHWARTZ B,ROBBINS H. Chemical etching of silicon III-a temperature study in the acid system[J]. Journal of the Electrochemical Society, 1961,108(4):365-372.

    [22] SCHWARTZ B,ROBBINS H. Chemical etching of silicon IV-etching technology[J]. Journal of the Electrochemical Society, 1976,123(11):1903-1909.

         SCHWARTZ B,ROBBINS H. Chemical etching of silicon IV-etching technology[J]. Journal of the Electrochemical Society, 1976,123(11):1903-1909.

    [23] SCHWARTZ B,ROBBINS H. Chemical etching of Germanium in solutions of HF,HNO3,H2O, and HC2H3O2[J]. Journal of the Electrochemical Society, 1964,111(2):196-201.

         SCHWARTZ B,ROBBINS H. Chemical etching of Germanium in solutions of HF,HNO3,H2O, and HC2H3O2[J]. Journal of the Electrochemical Society, 1964,111(2):196-201.

    [24] BAUHUBER M,MIKRIEVSKIJ A,LECHNER A. Isotropic wet chemical etching of deep channels with optical surface quality in silicon with HNA based etching solutions[J]. Materials Science in Semiconductor Processing, 2013,16(6):1428-1433.

         BAUHUBER M,MIKRIEVSKIJ A,LECHNER A. Isotropic wet chemical etching of deep channels with optical surface quality in silicon with HNA based etching solutions[J]. Materials Science in Semiconductor Processing, 2013,16(6):1428-1433.

    [25] HUI W C. How to prevent a runaway chemical reaction in the isotropic etching of silicon with HF/HNO3/CH3COOH or HNA solution[J]. Proceedings of SPIE, 2004 (5276):270-279.

         HUI W C. How to prevent a runaway chemical reaction in the isotropic etching of silicon with HF/HNO3/CH3COOH or HNA solution[J]. Proceedings of SPIE, 2004 (5276):270-279.

    [26] HEIDARI A,CHAN M L,YANG H A,et al. Hemispherical wineglass resonators fabricated from the microcrystalline diamond[J]. Journal of Micromechanics and Microengineering, 2013,23(12):125016-1-8.

         HEIDARI A,CHAN M L,YANG H A,et al. Hemispherical wineglass resonators fabricated from the microcrystalline diamond[J]. Journal of Micromechanics and Microengineering, 2013,23(12):125016-1-8.

    [27] HEIDARI A,CHAN M L,YANG H A,et al. Micromachined polycrystalline diamond hemispherical shell resonators[C]// IEEE 2013 Transducers & Eurosensors XXVII. Barcelona, Spain:IEEE, 2013:2415-2418.

         HEIDARI A,CHAN M L,YANG H A,et al. Micromachined polycrystalline diamond hemispherical shell resonators[C]// IEEE 2013 Transducers & Eurosensors XXVII. Barcelona, Spain:IEEE, 2013:2415-2418.

    [28] ALBERO J,NIERADKO L,GORECKI C,et al. Fabrication of spherical microlenses by a combination of isotropic wet etching of silicon and molding techniques[J]. Optics Express, 2009,17(8):6283-6292.

         ALBERO J,NIERADKO L,GORECKI C,et al. Fabrication of spherical microlenses by a combination of isotropic wet etching of silicon and molding techniques[J]. Optics Express, 2009,17(8):6283-6292.

    [29] LEE J K,CHOI J C,JANG W I,et al. Electrowetting lens employing hemispherical cavity formed by hydrofluoric acid, nitric acid, and acetic acid etching of silicon[J]. Japanese Journal of Applied Physics, 2012,51(6):06FL05-1-7.

         LEE J K,CHOI J C,JANG W I,et al. Electrowetting lens employing hemispherical cavity formed by hydrofluoric acid, nitric acid, and acetic acid etching of silicon[J]. Japanese Journal of Applied Physics, 2012,51(6):06FL05-1-7.

    [30] NEGI S,BHANDARI R,SOLZBACHER F. Novel isotropic and anisotropic etching of MEMS structures by controlling the dynamics of the etchant[C]// 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. Beijing: IEEE, 2011:2362-2365.

         NEGI S,BHANDARI R,SOLZBACHER F. Novel isotropic and anisotropic etching of MEMS structures by controlling the dynamics of the etchant[C]// 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. Beijing: IEEE, 2011:2362-2365.

    ZHENG Xianze, TANG Bin, WANG Yue, XIONG Zhuang. Research progress of micro-scale hemispherical resonator gyroscopes based on etching of HNA solution[J]. Journal of Terahertz Science and Electronic Information Technology , 2020, 18(3): 538
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