[1] Yang H Q. Analysis in current status of global PCB industry and top PCB makers (2015)[J]. Printed Circuit Information, 24, 11-15, 36(2016).

[2] Madić M, Petrović G, Petković D et al. Application of a robust decision-making rule for comprehensive assessment of laser cutting conditions and performance[J]. Machines, 10, 153(2022).

[3] Wang Y, Wang H T, Liu F et al. Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure[J]. Composites Part A: Applied Science and Manufacturing, 138, 106075(2020).

[4] Zhang X C, Qian J, Fu Q et al. Cutting of PBO fiber-reinforced composites using picosecond lasers[J]. Chinese Journal of Lasers, 47, 1002004(2020).

[5] Hu X D, Li Y L, Bai S Z et al. Research progress of laser application in material removal[J]. Laser & Optoelectronics Progress, 58, 0500008(2021).

[6] Wei X Y, Wen Q L, Lu J et al. Research on parameters optimization of diamond microgrooves processed by ultraviolet nanosecond laser[J]. Chinese Journal of Lasers, 49, 1002406(2022).

[7] Zhang T, Wu C Y, Rong Y M et al. Laser ablation behavior and mechanism of polyimide by UV irradiation[J]. Materials and Manufacturing Processes, 37, 809-815(2022).

[8] Zhang H W, Ren N, Xue H T et al. Temperature distribution for laser etching of metal thin films on polyimide substrate[J]. Chinese Journal of Lasers, 43, 0503009(2016).

[9] Wu C Y, Rong Y M, Li M et al. High-quality cutting of polypropylene (PP) film by UV nanosecond laser based on thermal ablation[J]. Optics & Laser Technology, 147, 107600(2022).

[10] Rong Y M, Huang Y, Li M et al. High-quality cutting polarizing film (POL) by 355 nm nanosecond laser ablation[J]. Optics & Laser Technology, 135, 106690(2021).

[11] Yang R W, Huang Y, Rong Y M et al. Evaluation and classification of CFRP kerf width by acoustic emission in nanosecond laser cutting[J]. Optics & Laser Technology, 152, 108165(2022).

[12] Zhao P F. Study on all-solid-state high stability 355 nm ultraviolet pulsed laser[D](2020).

[13] Zhang F, Zeng X Y, Li X Y et al. Laser etching and cutting printed circuit board by 355 nm and 1064 nm diode pumped solid state lasers[J]. Chinese Journal of Lasers, 35, 1637-1643(2008).

[14] Sun T Y, Xia M J, Qiao L. Failure mechanism and detection analysis of semiconductor laser[J]. Laser & Optoelectronics Progress, 58, 1900003(2021).

[15] Zhang Y L, Sun S F, Wang X et al. Research on quality of micro-holes fabricated by laser drilling[J]. Laser & Optoelectronics Progress, 58, 1900002(2021).

[16] Song J F, Zhao G, Ding Q J et al. Molecular dynamics study on the thermal, mechanical and tribological properties of PBI/PI composites[J]. Materials Today Communications, 30, 103077(2022).

[17] Wang W, Shen J, Liu W J et al. Effect of scanning speed of galvanometer on surface oxide layer of TA15 titanium alloy in pulsed laser cleaning[J]. Chinese Journal of Lasers, 48, 1802004(2021).

[18] Amara E H, Kheloufi K, Tamsaout T et al. Numerical investigations on high-power laser cutting of metals[J]. Applied Physics A, 119, 1245-1260(2015).

[19] Zhang F. Study on UV laser microprocessing technology and mechanism for electronic materials[D](2012).

[20] Jiang X Y, Wang F F, Zhou W et al. Ultrafast dynamics of femtosecond laser interactions with materials[J]. Chinese Journal of Lasers, 49, 2200002(2022).

[21] Wang J, Zhou R D, Zhang N et al. Process parameters of direct writing polyimide by 1064 nm fiber laser[J]. Chinese Journal of Lasers, 48, 1002112(2021).

[22] Zheng P C, Liu H D, Wang J M et al. Influences of laser pulse energy on physical characteristics of laser-induced aluminum alloy plasma[J]. Acta Photonica Sinica, 43, 0914003(2014).