According to heat transfer theory, a finite element model of high-power light emitting diode(LED) was established. Four kinds of bonding materials(silver conductive adhesive with high thermal conductivity, nano-silver paste, power chip bonding adhesive, Sn70Pb30), and four kinds of substrate material(Al2O3, AlN, Al-SiC, copper-molybdenum alloy)were chosen. ANSYS finite element thermal analysis software was used to simulate temperature field, and the optimal choice of materials for high-power LED package was obtained. The influences of the substrate thickness, chip output power and external heat sink on the LED junction temperature were studied. The results show that the nanometer silver soldering paste-AlN has the most superior radiation effect the increase of the substrate thickness will not increase the head dissipation capability obviously; because the signal LED output power is limited, the packaging structure should be optimized and the multi-chip array needs to be used to the illumination requirement; the external aluminum heat-sinking is able to achieve the ideal heat-sinking effect.