Test and evaluation method of non-linear effect of Electrically Conductive Adhesives under sinusoidal excitation

LI Guangwei; SHAO Weiheng; ZHANG Xiuyin; FANG Wenxiao; GAO Qiang

doi:10.11805/tkyda2018368

[1] CHEN Danghui,GU Ying,CHEN Xi. Research progress of conductive adhesives for microelectronics assembly abroad[J]. Electronic Components and Materials, 2002,21(2):34.

CHEN Danghui,GU Ying,CHEN Xi. Research progress of conductive adhesives for microelectronics assembly abroad[J]. Electronic Components and Materials, 2002,21(2):34.

[2] DUAN Guochen,QI Shuhua,WU Xinming,et al. Research progress of conductive adhesives for microelectronic packaging[J]. China Adhesives, 2010,19(2):54-60.

DUAN Guochen,QI Shuhua,WU Xinming,et al. Research progress of conductive adhesives for microelectronic packaging[J]. China Adhesives, 2010,19(2):54-60.

[3] LI L,MORRIS J E. Electrical conduction models for isotropically conductive adhesive joints[J]. IEEE Transactions on Components, Packaging,and Manufacturing Technology:Part A, 1997,20(1):3-8.

LI L,MORRIS J E. Electrical conduction models for isotropically conductive adhesive joints[J]. IEEE Transactions on Components, Packaging,and Manufacturing Technology:Part A, 1997,20(1):3-8.

[4] MIZUNO M,SAKA M,ABé H. Mechanism of electrical conduction though anisotropically conductive adhesive films[J]. IEEE Transactions on Components,Packaging, and Manufacturing Technology:Part A, 1996,19(4):546-553.

MIZUNO M,SAKA M,ABé H. Mechanism of electrical conduction though anisotropically conductive adhesive films[J]. IEEE Transactions on Components,Packaging, and Manufacturing Technology:Part A, 1996,19(4):546-553.

[5] LU Qinghua,HE Tianhong. Research on new conductive adhesives[J]. Functional Materials, 1997(5):546-549.

LU Qinghua,HE Tianhong. Research on new conductive adhesives[J]. Functional Materials, 1997(5):546-549.

[6] FU Zhenxiao,ZHANG Qitu,LING Zhida. Research and application of new conductive adhesive[J]. Jiangsu Ceramics, 2001, 34(2):16-17.

FU Zhenxiao,ZHANG Qitu,LING Zhida. Research and application of new conductive adhesive[J]. Jiangsu Ceramics, 2001, 34(2):16-17.

[7] ZWOLINSKI M,HICKMAN J,RUBIN H,et al. Electrically conductive adhesives for surface mount solder replacement[J]. IEEE Transactions on Components Packaging & Manufacturing Technology Part C, 1996,19(4):241-250.

ZWOLINSKI M,HICKMAN J,RUBIN H,et al. Electrically conductive adhesives for surface mount solder replacement[J]. IEEE Transactions on Components Packaging & Manufacturing Technology Part C, 1996,19(4):241-250.

[8] JAGT J C. Reliability of electrically conductive adhesive joints for surface mount applications:a summary of the state of the art[J]. IEEE Transactions on Components Packaging & Manufacturing Technology Part A, 1998,21(2):215-225.

JAGT J C. Reliability of electrically conductive adhesive joints for surface mount applications:a summary of the state of the art[J]. IEEE Transactions on Components Packaging & Manufacturing Technology Part A, 1998,21(2):215-225.

[9] NI Xiaojun,LIANG Tongxiang. Research progress of conductive adhesive[J]. Electronic Components and Materials, 2002, 21(1):1-3.

NI Xiaojun,LIANG Tongxiang. Research progress of conductive adhesive[J]. Electronic Components and Materials, 2002, 21(1):1-3.

[10] DUAN Guochen,QI Shuhua,WU Xinming,et al. Research progress of conductive adhesives for microelectronic packaging[J]. China Adhesives, 2010,19(2):54-60.

DUAN Guochen,QI Shuhua,WU Xinming,et al. Research progress of conductive adhesives for microelectronic packaging[J]. China Adhesives, 2010,19(2):54-60.

[11] MA H,LI Z,TIAN X,et al. Silver flakes and silver dendrites for hybrid electrically conductive adhesives with enhanced conductivity[J]. Journal of Electronic Materials, 2018,47(5):1-11.

MA H,LI Z,TIAN X,et al. Silver flakes and silver dendrites for hybrid electrically conductive adhesives with enhanced conductivity[J]. Journal of Electronic Materials, 2018,47(5):1-11.

[12] MAO Yuru,LIU Ying,XIE Yongjun,et al. Numerical analysis of passive intermodulation effect caused by metal contact nonlinearity[J]. Acta Electronica Sinica, 2015,43 (6):1174-1178.

MAO Yuru,LIU Ying,XIE Yongjun,et al. Numerical analysis of passive intermodulation effect caused by metal contact nonlinearity[J]. Acta Electronica Sinica, 2015,43 (6):1174-1178.

[13] HU Xiangfeng,ZHANG Yanhua. Nonlinear analysis of receiver[J]. Journal of Terahertz Science and Electronic Information, Technology, 2008,6(6):440-443.

HU Xiangfeng,ZHANG Yanhua. Nonlinear analysis of receiver[J]. Journal of Terahertz Science and Electronic Information, Technology, 2008,6(6):440-443.

[14] BARTO S,MACH P. Resistance and non-linearity of electrically conductive adhesives aged by thermal,humidity and combined aging[C]// Design and Technology in Electronic Packaging. Timisoara:IEEE, 2011:59-62.

BARTO S,MACH P. Resistance and non-linearity of electrically conductive adhesives aged by thermal,humidity and combined aging[C]// Design and Technology in Electronic Packaging. Timisoara:IEEE, 2011:59-62.

[15] BARTO S,MACH P. Nonlinear distortion of C/V characteristic-useful tool for diagnostics of electrically conductive adhesives: theoretical background, measuring equipment,selected applications[C]// Diagnostics in Electrical Engineering. Pilsen:IEEE, 2016:1-4.

BARTO S,MACH P. Nonlinear distortion of C/V characteristic-useful tool for diagnostics of electrically conductive adhesives: theoretical background, measuring equipment,selected applications[C]// Diagnostics in Electrical Engineering. Pilsen:IEEE, 2016:1-4.