[1] KISTRUP K, POULSENC E, Hansen M F, et al.. Ultrasonic welding for fast bonding of self-aligned structures in lab-on-a-chip systems ［J］. Lab on a Chip, 2015, 15(9): 1998-2001.

[2] FAN J H, DENG Y B, XUAN M, et al.. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips［J］. Opt. Precision Eng.., 2015, 23(3): 708-713. (in Chinese)

[3] THORSEN T, MAERKL S J, QUAKE S R, et al.. Microfluidic large-scale integration［J］. Science, 2002, 298(5593): 580-584.

[4] ZHANG Z B. Study on the mechanism and methods of ultrasonic bonding for polymer microfludic chips［D］. Dalian: Dalian University of Technology, 2010. (in Chinese)

[5] YIN Z F, SUN L, CHENG E L, et al.. Two dimensional PMMA nanofluidic device fabricated by hot embossing and oxygen plasma assisted thermal bonding methods［J］. Nanotechnology, 2015, 26(21): 215302.

[6] WANG X D, JIN J, LI X, et al.. Low-pressure thermal bonding［J］. Microelectronic Engineering, 2011, 88(8): 2427-2430.

[7] LI J M, LIANG CH, ZHANG H, et al.. Reliable and high quality adhesive bonding for microfluidic devices［J］. Micro & Nano Letters, 2017, 12(2): 90-94.

[8] XU ZH, WANG J ZH, YANG D, et al.. Effect of assistant solvent on in-mold bonding of PMMA microfluidic chips［J］. Opt. Precision Eng., 2012, 20(2): 321-328. (in Chinese)

[9] LIU CH, ZHOU L J, LI J M, et al.. Joint structure and processing parameters of ultrasonic precision bonding for point-of-care testing chips［J］. Opt. Precision Eng., 2016, 24(5): 1057-1064. (in Chinese)

[10] TRUCKENMüLLER R, CHENG Y, AHRENS R, et al.. Micro ultrasonic welding: joining of chemically inert polymer microparts for single material fluidic components and systems［J］. Microsystem Technologies, 2006, 12(10-11): 1027-1029.

[11] LUO Y, HE SH Q, WANG L J, et al.. Study on ultrasonic fusion bonding for polymer microfluidic chips［J］. Key Engineering Materials, 2011, 483: 311-315.

[12] CAI W L, XIONG T, YIN ZH P. Type synthesis of a rotational decoupled leveling mechanism based on screw theory［J］. China Mechanical Engineering, 2012, 23(18): 2213-2217. (in Chinese)

[13] KIM D, JANG W I, CHOI B Y, et al.. Focusing and leveling system using position-sensitive detectors for the wafer steppers［J］. Proceedings of the SPIE, 1994, 2197: 997-1003.

[14] YU ZH W, YU J J, ZONG G H, et al.. Conceptual design of compliant leveling mechanism［J］. Journal of Beijing University of Aeronautics and Astronautics, 2005, 31(7): 714-717. (in Chinese)

[15] HUANG Y C, LEE C Y, CHEN C R. Theoretical and experimental design of a new flexible hinged positioning stage［J］. Journal of the Chinese Society of Mechanical Engineers, 2012, 33(1): 59-62.

[16] WANG H X, CHAI P, WANG G W, et al.. Design and analysis of precision centering and leveling table based on flexible mechanism［J］. Journal of Machine Design, 2016, 33(7): 27-30. (in Chinese)

[17] CHUAH Y K, CHIEN L H J, CHANG B C, et al.. Effects of the shape of the energy director on far-field ultrasonic welding of thermoplastics［J］. Polymer Engineering & Science, 2000, 40(1): 157-167.