• Infrared Technology
  • Vol. 44, Issue 12, 1332 (2022)
Baihong LIU1, Weiping YANG1, Xiang LIANG1, Lili YANG1、2, Haonan DU1, Jiabing BAO1, Chunming SHI1, Yuexia MA1, Yane YIN1, and Yu DUAN1、2
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
  • show less
    DOI: Cite this Article
    LIU Baihong, YANG Weiping, LIANG Xiang, YANG Lili, DU Haonan, BAO Jiabing, SHI Chunming, MA Yuexia, YIN Yane, DUAN Yu. Study on Dual-Fluid Spray Cleaning Technique for Single-wafer Particle Removal[J]. Infrared Technology, 2022, 44(12): 1332 Copy Citation Text show less
    References

    [6] WU Y, Franklin C, Bran M, et al. Acoustic property characterization of a single wafer megasonic cleaner[J]. Semiconductor Fabtech, 1999(9): 177.

    [11] Kanno I. Wafer cleaning by water and gas mixture with high velocity[J]. The Electrochemical Society Proceeding, 1997, 35: 54-61.

    [12] Hirano H, Sato K, Osaka T, et al. Damage-free ultradiluted HF/nitrogen jet spray cleaning for particle removal with minimal silicon and oxide loss[J]. Electrochemical and Solid State Letters, 2006, 9(2): 62-65.

    [13] LI J, Sih V, ZHAN H. Advanced wet clean technology at lightly doped drain layers in FinFET[J]. ECS Transactions, 2016, 75(5): 185-190.

    [14] LU W, XIE B, LI Z F. An innovative jet spray for better particle removal efficiency in single wafer damage-free cleans for 65 nm node and beyond[C]//ECS Meeting Abstracts, 2007, 18: 1042.

    [15] Tanaka T, Sato M, Kobayashi M, et al. Development of a novel advanced spray technology based on investigation of droplet energy and pattern damage[C]//Solid State Phenomena, Trans Tech Publications Ltd, 2012,

    [16] TENG Y, CUI H, HEX, et al. Damage free removal of nano-particles with dual-fluid spray nozzle cleaning[C]// China Semiconductor Technology International Conference (CSTIC) of IEEE, 2016: 1-3.

    [20] Light T S, Kingman B, Bevilacqua A C. The conductivity of low concentrations of CO2 dissolved in ultrapure water from 0-100 ℃ [C]//209th American Chemical Society National Meeting. 1995: 2-6.

    [21] Kalantari D, Tropea C. Phase doppler measurements of spray impact onto rigid walls[J]. Exp. Fluids, 2007, 43: 285-296.

    [22] Wostyn K, Wada M, Sano K I, et al. Spray systems for cleaning during semiconductor manufacturing[C/OL]//22nd European Conference on Liquid Atomization and Spray Systems, 2008: https://www. semanticscholar.org/paper/SPRAY-SYSTEMS-FOR-CLEANING-DURING-SEMICONDUCTOR-Wostyn-Wada/590875d2408ceb18b 97969233 db526e62205a1a7.

    [23] Yarin A L, Weiss D A. Impact of drops on solid surfaces: self-similar capillary waves, and splashing as a new type of kinematic discontinuity[J]. Fluid Mech. 1995, 283: 141-173.

    [24] SUN Z, HAN R. Numerical studies on nano-particle removal with micro-droplet spray[C]// 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2006: 303-305.

    LIU Baihong, YANG Weiping, LIANG Xiang, YANG Lili, DU Haonan, BAO Jiabing, SHI Chunming, MA Yuexia, YIN Yane, DUAN Yu. Study on Dual-Fluid Spray Cleaning Technique for Single-wafer Particle Removal[J]. Infrared Technology, 2022, 44(12): 1332
    Download Citation