• Chip
  • Vol. 3, Issue 2, 100096 (2024)
Chengjun Li, Yubo Luo*, Wang Li, Boyu Yang..., Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li and Junyou Yang**|Show fewer author(s)
Author Affiliations
  • State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
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    DOI: 10.1016/j.chip.2024.100096 Cite this Article
    Chengjun Li, Yubo Luo, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li, Junyou Yang. The on-chip thermoelectric cooler: advances, applications and challenges[J]. Chip, 2024, 3(2): 100096 Copy Citation Text show less
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    Chengjun Li, Yubo Luo, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li, Junyou Yang. The on-chip thermoelectric cooler: advances, applications and challenges[J]. Chip, 2024, 3(2): 100096
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