The evolution of integrable， compact， portable， and multifunctional microelectronic devices has encouraged researchers to develop high-performance microcapacitors. In this study， capacitors were divided into conventional capacitors and microcapacitors， and the structural characteristics of conventional aluminum electrolytic capacitors， tantalum electrolytic capacitors， organic thin film capacitors， and ceramic capacitors were discussed. Additionally， the advantages and disadvantages associated with their production and applications were discussed considering their structural characteristics， technical process， and main performance indicators. Furthermore， the on-chip integrated system process compatibility of solid-state microcapacitors （metal-insulator-metal and metal-insulator-semiconductor） and microsupercapacitors for energy storage was investigated. The main manufacturing process， three research directions （electrode surface areas， insulating materials， electrode materials）， and related research progress of on-chip 3D silicon-based capacitor structure were reported. Finally， the development trend of microcapacitors was predicted.