[1] Alan M. Lighting: the progress & promise of LEDs. III-Vs Review, 2004, 17(4): 39-41
[2] Poppe A, MicReD D, Mentor G B, Lasance C J M. On the standardization of thermal characterization of LEDs. In: Proceedings of the 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2009, 151-158
[3] Park J, Shin M, Lee C C. Measurement of temperature profiles on visible light-emitting diodes by use of a nematic liquid crystal and an infrared laser. Optics Letters, 2004, 29(22): 2656-2658
[4] Yovanovich M M, Marotta E E. Thermal Spreading and Contact Resistances. New Jersey: Wiley, 2003, 261-395
[5] Krishna Reddy G V, Chikkanna N, Uma Maheswar Gowd B. Experimental evaluation of thermal resistance of composites. International Journal of Recent Technology and Engineering, 2012, 1(2): 16-21
[6] Lyeo H, Cahill D G. Thermal conductance of interfaces between highly dissimilar materials. Physical Review B, 2006, 73(14): 144301
[7] Fletcher L S. A review of thermal enhancement techniqeus for electronic systems. IEEE Transations on components, Hybrids and Manufacturing technology, 1990, 13(4): 1012-1021
[8] Prasher R. Thermal interface materials: historical perspective, status, and future directions. Proceedings of the IEEE, 2006, 94(8): 1571-1586
[9] Vermeersch B, De Mey G. Influence of thermal contact resistance on thermal impedance of microelectronic structures. Microelectronics and Reliability, 2007, 47(8): 1233-1238
[10] Joint Electron Device Engineering Council (JEDEC). Transient dual interface test method for the measurement of the thermal resistance junction to case semiconductor devices with heat flow through a single path. JESD51-14, 2010
[11] Alexandre V. Fall with linear drag and Wien’s displacement law: approximate solution and Lambert function. European Journal of Physics, 2012, 33(4): 751-755
[12] Chhajed S, Xi Y, Gessmann T, Xi J Q, Shah J M, Kim J K, Schubert E F. Junction temperature in light-emitting diodes assessed by different method. In: Proceedings of SPIE 5739, Light-Emitting Diodes: Research, Manufacturing, and Applications IX. 2005, 16-24