In order to improve the performance of ceramic bonded diamond grinding wheels, microwave sintering technology was used, and the effects of microwave sintering temperature, ceramic bond content and diamond abrasive size on the performance of ceramic bonded diamond grinding wheels were analyzed through a series of experiments. The results show that microwave sintering temperature is the most important factor affecting the performance of ceramic bonded diamond grinding wheels, far exceeding the remaining two. The Rockwell hardness and bending strength of ceramic bonded diamond grinding wheel specimen reach great value at 740 ℃ and the porosity is small. The Rockwell hardness is 66 HRB, the bending strength is 76.5 MPa and the porosity is 17.8%. It is observed from the microstructure that the ceramic bonded diamond grinding wheels achieve the uniform encapsulation of diamond abrasive by ceramic bond at 740 ℃, and there are few pores.