[1] TREUTTEL J,GATILOVA L,MAESTRINI A,et al. A 520-and remote sensing with 1 070 K-1 500 K DSB noise temperature at room temperature[J]. IEEE Transactions on Terahertz Science & Technology, 2016,6(1):148-155.
[2] HAMMAR A,SOBIS P,Drakinskiy V,et al. Low noise 874 GHz receivers for the international submillimetre airborne radiometer[J]. Review of Scientific Instruments, 2018,89(5):055104.
[3] LIU G,ZHANG B,ZHANG L S,et al. 0.42 THz subharmonic mixer based on 3D precisely modeled diode[J]. Journal of Infrared and Millimeter Waves, 2018,37(3):338-343.
[4] WANG C,HE Y,LU B,et al. Robust sub-harmonic mixer at 340 GHz using intrinsic resonances of Hammer-Head filter and improved diode model[J]. Journal of Infrared Millimeter & Terahertz Waves, 2017,38(1):1-19.
[5] THOMAS B,MAESTRINI A,BEAUDIN G. A low-noise fixed-tuned 300-360 GHz sub-harmonic mixer using planar Schottky diodes[J]. IEEE Microwave and Wireless Components Letters, 2005,15(12):865-867.
[8] SCHLECHT E, ILES JV,LEE C,et al. Schottky diode based 1.2 THz receivers operating at room-temperature and below for planetary atmospheric sounding[J]. IEEE Transactions on Terahertz Science & Technology, 2014,4(6):661-669.
[9] PETER S,DRAKINSKIY V,EMRICH A,et al. 300 GHz to 1.2 THz GaAs Schottky membrane TMIC’s for next generation space missions[C]// 24th International Symposium on Space Terahertz Techniques. Groningen,Netherlands:[s.n.], 2013.
[10] THOMAS B,SILES J,GILL J,et al. 560 GHz,664 GHz and 1.2 THz Schottky based MMIC sub harmonic mixers for planetary atmospheric remote sensing and FMCW radar[C]// Proceeding of International Symp. Space THz Technology. Tucson,AZ, USA:[s.n.], 2011:26-28.
[11] SOBIS P J,WADEFALK N,EMRICH A,et al. A broadband,low noise,integrated 340 GHz Schottky diode receiver[J]. IEEE Microwave and Wireless Components, 2012,22(7):366-368.
[12] DRAKINSKIY V,SOBIS P,ZHAO H,et al. Terahertz GaAs Schottky diode mixer and multiplier MIC’s based on e-beam technology[C]// 2013 International Conference on Indium Phosphide and Related Materials(IPRM). Kobe,Japan:IEEE, 2013:1-2.