• Optics and Precision Engineering
  • Vol. 17, Issue 6, 1267 (2009)
MING Ping-mei1,2,*, ZHU Di1, ZHOU Feng1, HU Yang-yang1, and ZENG Yong-bin1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: Cite this Article
    MING Ping-mei, ZHU Di, ZHOU Feng, HU Yang-yang, ZENG Yong-bin. Fabrication of metal micro-precision sieves with high open areas using UV-LIGA process[J]. Optics and Precision Engineering, 2009, 17(6): 1267 Copy Citation Text show less
    References

    [1] WIESNER R.Filter media:Johns Manville-filtration in defiance [J].Filtration & Separation,2008,45(1):36-37.

    [2] GOUKLER B R.Metal stencil overview [J].SMTSurface Mount Technology Magazine,2001,15(4):84-87.

    [3] GOLDBERG H D,BROWN R,LIU D P,et al..Screen printing:a technology for the batch fabrication of integrated chemical-sensor arrays [J].Sensots and Actuators,1994,21(3):171-183.

    [4] BACHER W,MENZ W,MOHR J.The LIGAtechnique and its potential for microsystems-a survey[J].IEEE Transactions On Industrial Electronics, 1995,42(5):431-441.

    [5] TOLFREE D.Commercializing HARMST-LIGA technologies [J].Microsystems Technology,2008,14(9-11):1487-1489.

    [6] QU W N,WENZEL C,JAHN A,et a1..UV-LI-GA:a promising and low-cost variant for microsystem technology [C].Conference on Optoelectronic & Microelectronic Materials and Devices.Proceedings,COMMAD,1999:380-383.

    [7] MING P M,ZHU D,HU Y Y,et al..Fabricationof nickel soft contact microprobe based on UV-LI-GA [J].Optics and Precision Engineering,2007,15(5):735-740.(in Chinese)

    [8] YOU X Z,YOU X Y,BAI Y.Specification and quality indicators of nickel screen [J].Dyeing andFinishing,2006(17):26-28.(In Chinese)

    [9] MING P M,ZHU D,HU Y Y,et al..Novel microelectroforming technique with assisting low airpressure alternately and temperature-gradient [J].Binggong Xuebao,2008,29(6):746-751.(in Chinese)

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    MING Ping-mei, ZHU Di, ZHOU Feng, HU Yang-yang, ZENG Yong-bin. Fabrication of metal micro-precision sieves with high open areas using UV-LIGA process[J]. Optics and Precision Engineering, 2009, 17(6): 1267
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