• Optics and Precision Engineering
  • Vol. 17, Issue 10, 2440 (2009)
GUO Liang* and WU Qing-wen
Author Affiliations
  • [in Chinese]
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    DOI: Cite this Article
    GUO Liang, WU Qing-wen. Thermal design and proof tests of CCD components in spectral imagers[J]. Optics and Precision Engineering, 2009, 17(10): 2440 Copy Citation Text show less

    Abstract

    The spectral imager is a complex space optical remote sensor with multiple optical channels and detectors,in which CCD components play a decisive role for imaging quality of the system. In this paper,the conspicuous characteristics of CCD components,such as small volume,high heat productivity and fast temperature rise speed,are discussed and analyzed. The keys in the thermal design are solved,then a corresponding thermal design schemes of CCD components is introduced. Moreover,the total thermal resistance of CCD components along a heat transfer path is calculated through a simplified thermal resistance analytic model,which shows the total thermal resistance along the heat transfer path is 1.291 ℃/W.The CCD components are also simulated by the software IDEAS-TMG and the guide line of thermal control is achieved. Finally,the thermal design scheme is verified by proof heat tests. The test results indicate the temperature rise speed is 0.6 ℃/min when CCD components are working,and the maximum temperature in two tests are 33.6 ℃ and 26.2 ℃, respectively. These results conclude that proposed thermal design scheme can control high heat productivty and fast temperature rise for CCD components effectively.
    GUO Liang, WU Qing-wen. Thermal design and proof tests of CCD components in spectral imagers[J]. Optics and Precision Engineering, 2009, 17(10): 2440
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