• Acta Photonica Sinica
  • Vol. 51, Issue 4, 0412006 (2022)
Fupei WU1, Guanlin YU1, Cong LE1, Weilin YE1, and Shukai ZHU2、*
Author Affiliations
  • 1Department of Mechanical Engineering,College of Engineering,Shantou University,Shantou,Guangdong 515063,China
  • 2OPT Machine Vision Tech Co.,Ltd.,Dongguan,Guangdong 523860,China
  • show less
    DOI: 10.3788/gzxb20225104.0412006 Cite this Article
    Fupei WU, Guanlin YU, Cong LE, Weilin YE, Shukai ZHU. Three-dimensional Measurement Method of Glue Surface During the Mounting Process of Micro-camera Module[J]. Acta Photonica Sinica, 2022, 51(4): 0412006 Copy Citation Text show less
    References

    [1] Limei SONG, Xinglin ZHOU, Kexin XU et al. Three-dimensional defect detection based on single measurement image. Acta Optica Sinica, 25, 45-50(2005).

    [2] Y D LI, P H GU. Free-form surface inspection techniques state of the art review. Computer Aided Design, 36, 1395-1417(2004).

    [3] H M SIDKI, M AMER. Evaluation of CMM for flatness measurements. Metrology and Measurement Systems, 15, 585-593(2008).

    [4] X Z GUO, Z Y SHI, B YU et al. 3D measurement of gears based on a line structured light sensor. Precision Engineering, 61, 160-169(2020).

    [5] Ximeng LIN, Jing YU, Yanling YANG et al. Study on contact scanning probe dynamic characteristics of high precision 3D thread measuring machine. Chinese Journal of Scientifi Instrument, 38, 2564-2572(2017).

    [6] Qiangxian HUANG, Fuling YU, Ermin GONG et al. Nano-CMM stage with zero Abbe error and its error analysis. Optics and Precision Engineering, 21, 664-671(2013).

    [7] Mengchao MA, Huaxia DENG, Jin ZHANG et al. High speed 3-D shape measurement using projector defocusing. Chinese Journal of Scientific Instrument, 42, 92-98(2021).

    [8] Baofeng HE, Siyuan DING, Cuie WEI et al. Review of measurement methods for areal surface roughness. Optics and Precision Engineering, 27, 78-93(2019).

    [9] Meng GUO, Liaolin HU, Jie LI. Local point cloud reconstruction of ceramic-bowl-surface defect based on multi-image sequences. Acta Optica Sinica, 37, 247-253(2017).

    [10] Jiabao WANG, Shirong ZHANG, Qingya ZHOU. Vision based real-time 3D displacement measurement using weighted iterative EPnP algorithm. Chinese Journal of Scientific Instrument, 41, 166-175(2020).

    [11] Sensen MENG, Ning CAI, Bin LIN. Threshold-optimized dithering technique for high-quality 3D shape measurement. Acta Photonica Sinica, 48, 0812002(2019).

    [12] W ZHANG, L D YU, W S LI et al. Block-box phase error compensation for digital phase-shifting profilometry. IEEE Transactions on Instrumentation and Measurement, 66, 2755-2761(2017).

    [13] J H WANG, Y G ZHOU, Y X YANG. Three-dimensional measurement method for nonuniform reflective objects. IEEE Transactions on Instrumentation and Measurement, 69, 9132-9143(2020).

    [14] Y C SHUANG, Z Z WANG. Active stereo vision three-dimensional reconstruction by RGB dot pattern projection and ray intersection. Measurement, 167, 108195(2021).

    [15] Z Z WANG, Q ZHOU, Y C SHUANG. Three-dimensional reconstruction with single-shot structured light dot pattern and analytic solutions. Measurement, 151, 107114(2020).

    [16] Jiandong SU, Xiaohui QI, Xiusheng DUAN. Plane pose measurement method based on monocular vision and checkboard target. Acta Optica Sinica, 37, 218-228(2017).

    [17] F P WU, S P LI, X M ZHANG et al. A design method for LEDs arrays structure illumination. Journal of Display Technology, 12, 1177-1184(2016).

    [18] A BERDEU, F MOMEY, B LAPERROUSAZ et al. Comparative study of fully three-dimensional reconstruction algorithms for lens - free microscopy. Applied Optics, 56, 3939-3951(2017).

    [19] Fupei WU, Jiahua GUO, Xianmin ZHANG et al. 3D quality inspection method for PCB solder joint surface. Chinese Journal of Scientific Instrument, 39, 233-240(2018).

    [20] Fupei WU, Jiahua GUO, Shengping LI et al. Arc measurement method of curved surface based on monocular vision system. Acta Photonica Sinica, 47, 126-136(2018).

    [21] Fupei WU, Shukai ZHU, Shengping LI. Coplanarity inspection method for integrated circuit pins based on single image. Acta Optica Sinica, 40, 299-306(2020).

    Fupei WU, Guanlin YU, Cong LE, Weilin YE, Shukai ZHU. Three-dimensional Measurement Method of Glue Surface During the Mounting Process of Micro-camera Module[J]. Acta Photonica Sinica, 2022, 51(4): 0412006
    Download Citation