Fig. 1. (a) Operation mechanism of Peltier element as thermal diode; (b) the operation mechanism of k_H element as thermal diode; (c) the operation mechanism of HTCM element. (a) Peltier元件作为热二极管的工作机制; (b) k_H元件作为热二极管的工作机制; (c) HTCM元件工作机制

Fig. 2. (a) Schematic diagram of the full solid state MR model based on a thermal diode^[21]; (b) comparison of maximum SCP and exergy efficiency between MR system with thermal diode and parallel-plate AMR at different temperature spans and different frequencies^[26]. (a) 基于热二极管的全固态MR模型结构示意图^[21]; (b) 带有热二极管的MR系统与平行板AMR在不同温跨和不同频率下最大SCP和㶲效率的比较^[26]

Fig. 3. (a) Schematic diagram of the full solid state MR system model^[28]; (b) temperature distribution over the length of the device^[28]. (a)全固态MR系统模型结构示意图^[28]; (b)器件长度方上的温度分布^[28]

Fig. 4. (a) Schematic diagram of a full solid state MR model based on thermal switch^[30]; (b) operating principle^[23]; (c) variation of COP and SCP with different current^[23]; (d) variation of COP and SCP with the length of Peltier element ^[23]. (a)基于热二极管的全固态MR模型示意图^[30]; (b)工作原理^[23]; (c)不同电流下COP和SCP的变化^[23]; (d) Peltier元件不同长度下COP和SCP的变化^[23]

Fig. 5. (a) Schematic diagram of the full solid state magnetic refrigeration system^[24]; (b) MUR cycle principle^[31]; (c) Gd-only^[31]; (d) parallel sheets^[31]; (e) topology optimization structure^[31]; (f) experiment setup^[31]; (g) variation of maximum SCP with different Peltier supply voltages^[31]; (h) variation of Peltier COP and temperature difference with different rotating speeds^[31]. (a) 全固态MR系统示意图^[24]; (b) MUR循环原理^[31]; (c) 仅Gd^[31]; (d) 平行板^[31]; (e) 拓扑优化结构^[31]; (f) 实验设置^[31]; (g)最大SCP随Peltier电源电压的变化^[31]; (h) Peltier COP和温差随转速的变化^[31]

Fig. 6. (a) A full solid state magnetic refrigeration model based on k_H element and magnetic Brayton cycle^[32]; (b) variation of SCP with operating frequency at different operating temperatures^[32]; (c) maximum SCP and COP as a function of temperature^[32]. (a) 基于k_H元件和磁Brayton循环的全固态MR模型^[32]; (b) 不同工作温度下SCP随工作频率的变化^[32]; (c)最大SCP和COP随温度的变化^[32]

Fig. 7. (a) Working mechanism of the cascaded full solid state magnetic refrigeration system^[33]; (b) variation of temperature span with operating temperature for different MCM components^[33]; (c) dependence of the temperature span on the operating frequency for different thermal conductivities of the MCM^[34]. (a) 级联全固态MR系统的工作机制^[33]; (b) 不同MCM元件数量下温跨随工作温度的变化^[33]; (c) 不同热导率的MCM下温跨与工作频率的关系^[34]

Fig. 8. (a) Variation of temperature span with rotating speed at different lattice numbers^[24]; (b) variation of maximum SCP with rotating speed at different temperature spans and lattice numbers^[24]; (c) variation of maximum SCP and COP with different rotating speeds at 32 lattices^[24]. (a)不同网格数下温跨与转速的关系^[24]; (b)不同温跨网格数下最大SCP与转速的关系^[24]; (c) 32网格下最大SCP和COP与转速的关系^[24]

Table 2. Comparison of main performances between full solid state MR model and traditional AMR model.