[1] CHOU S Y, KRAUSS P R, RENSTROM P J. Imprint of sub-25 nm vias and trenches in polymers[J]. Applied Physics Letters, 1995, 67(21):3114-3116.
[4] SCHMITT H. Full wafer microlens replication by UV imprint lithography[J]. Microelectronic Engineering, 2010, 87(5-8):1074-1076.
[5] PERENTOS A G K, MITCHELL A. Polymer long-period raised rib waveguide gratings using nano-imprint lithography [J].LEEE Photonics Technology Letters, 2005,17(12):2595-2597.
[6] LI M T. Large area direct nanoimprinting of SiO2-TiO2 gel gratings for optical applications [J]. Journal of Vacuum Science & Technology B, 2003,21(2):660-663.
[7] BYEON K J,HWANG S Y,LEE H. Fabrication of two-dimensional photonic crystal patterns on GaN-based light-emitting diodes using thermally curable monomer-based nanoimprint lithography[J]. Applied Physics Letters, 2007,91(9):091106.
[8] HSU Q C. Fabrication of photonic crystal structures on flexible organic light-emitting diodes using nanoimprint[J]. Microelectronic Engineering, 2012,91:178-184.
[9] CHANG A S P. Tunable liquid crystal-resonant grating filter fabricated by nanoimprint lithography[J]. LEEE Photonics Technology Letters, 2007,19(17-20):1457-1459.
[10] VIHERIALA J. Applications of UV-nanoimprint soft stamps in fabrication of single-frequency diode lasers [J]. Microelectronic Engineering, 2009,86(3):321-324.
[11] YANAGISAWA M. Evaluation of nanoimprint lithography as a fabrication process of phase-shifted diffraction gratings of distributed feedback laser diodes[J]. Journal of Vacuum Science & Technology B, 2009,27(6):2776-2780.
[12] MALYARCHUK V. High performance plasmonic crystal sensor formed by soft nanoimprint lithography[J]. Optics Express, 2005,13(15):5669-5675.
[13] PARK H S, SHIN H H, SUNG M Y,et al.. 2007 Novel process to improve defect problems for thermal nanoimprint lithography[J]. IEEE Transactions on Semiconductor Manufacturing,2007,20:13-9.
[14] WANG D L,ZHOU N,WANG L,et al..Study of nanoimprint lithography in fabrication DFB gratings for semiconductor laser diodes [J].Micronanoelectronic Technology,2009,47(1):1-4.(in Chinese)