Licalized electrochemical deposition technology is investigated based on a novel type of microelectrode and automatic control technique. The novel microelectrode is fixed on the microstepper motor. The speed of the stepper motor can be controlled. When the rate keeps the same as the deposition rate, the small gap between the microelectrode and the cathode will be able to basically remain unchanged. In this research, mixed electrolyte of 0.5 M/L CuSO4 and 0.38 M/L H2SO4 is selected. Cu micro column with high aspect ratio can be successfully deposited on Cu cathode from the plating solution. The aspect ratio can be greater than 7.2∶1. Micro column in diameter can be less than 120 μm. The experimental results indicate that this method can fabricate microstructures with low cost and high efficiency. It is expected that this new method will serve micro-opto-electro-mechanical systems and other micro/nano-structure preparation effectively.