Fig. 1. The designed multi-layer structure. From left to right, there are cooling load, electrode, ferroelectric ceramic layer EC1, electrode, ferroelectric ceramic layer EC2, electrode, and heat sink.
Fig. 3. The transferred heat Q as a function of the temperature difference between load and heat sink (Tload – Tsink). Here, case 1 is the transferred heat of the proposed MLCC with EC effect, case 2 is the transferred heat of the same structure without EC effect, and case 3 is the transferred heat of the same structure replacing EC layers with Ni metal.