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    Journals >Semiconductor Optoelectronics >Volume 44 >Issue 5 >Page 699 > Article
    • Semiconductor Optoelectronics
    • Vol. 44, Issue 5, 699 (2023)
    Research on the Influence of Dynamic Balance of Abrasive Layer on the Rough Grinding Process of Sapphire Substrate
    DING Peng* and LI Bing
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    DOI: 10.16818/j.issn1001-5868.2023070202 Cite this Article
    DING Peng, LI Bing. Research on the Influence of Dynamic Balance of Abrasive Layer on the Rough Grinding Process of Sapphire Substrate[J]. Semiconductor Optoelectronics, 2023, 44(5): 699 Copy Citation Text show less
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    DING Peng, LI Bing. Research on the Influence of Dynamic Balance of Abrasive Layer on the Rough Grinding Process of Sapphire Substrate[J]. Semiconductor Optoelectronics, 2023, 44(5): 699
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