Yong ZHOU, Qi WANG, Xiang GAO, Junjian GAO, Chunyan TAO, Mingming HAO. Research on packaging technology of high power blue semiconductor laser bar[J]. Optics and Precision Engineering, 2023, 31(22): 3237
- Optics and Precision Engineering
- Vol. 31, Issue 22, 3237 (2023)
Fig. 1. Three packaging structures
Fig. 2. CS package structure
Fig. 3. Vacuum eutectic reflux curve
Fig. 4. SEM of AuSn solder at different bonding temperatures
Fig. 5. Wavelength change curve under different bonding pressure and temperature
Fig. 6. Curve of the relationship between different bonging times and device thermal resistance
Fig. 7. Photoelectric characteristic curve under different bonding pressure
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Table 1. Spectral and photoelectric parameters under 0.3 N bonding pressure
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